Signature matching device and objects provided with signature spanning device

专利摘要:
SUMMARY The invention relates to a device for signature adaptation, comprising a surface element arranged to assume a certain thermal distribution, wherein said surface element comprises at least one temperature generating element arranged to generate at least one predetermined temperature gradient to a portion of a first surface conductive heat conductive conductor. in that said signature matching device comprises a liquid cooling element arranged to provide at least one liquid flow, thermally contacting an inner portion of said at least one temperature generating element so that heat energy is dissipated from said at least one temperature generating element.
公开号:SE1350855A1
申请号:SE1350855
申请日:2013-07-09
公开日:2015-01-10
发明作者:Peder Sjölund；Jussi Myllyluoma
申请人:BAE Systems Hägglunds AB；
IPC主号:

专利说明:

int I, Pelee,. and reigilrerlepirlrkg ILLILL. TECHNICAL FIELD The present invention relates to a device for signature adaptation according to the preamble of claim 1. The present invention furthermore relates to an object which is also attached to an object.....................................
BACKGROUND Military vehicles / vehicles have been exposed to threats in a war situation, for example, where they may be attacked from land, air and water. Therefore, it is unfortunate that the vehicle is as black as possible to detect, classify and identify. For this breath, military vehicles are often camouflaged against the background so that they are responsible for detecting, classifying and identifying with the naked eye. Furthermore, they are weak to detect in Norwegians with different types of image intensifiers. A problem is that attacking vehicles such as combat vehicles and aircraft are often equipped with a combination of one or more active and / or passive sensor systems including radar and electro-optical / infrared (E0 / IR) sensors, whereby the vehicles / vehicles become relatively simple. detect, classify and identify. Users of such sensor systems are looking for a certain type of thermal / reflective contour that does not normally occur in nature, usually different edge geometries, and / or large uniformly warm and / or evenly reflective surfaces.
To protect themselves against such systems, different types of techniques are used today in the field of signature adaptation. Signature adaptation techniques include construction techniques and are often combined with advanced material techniques to provide a specific emitting and / or reflecting surface of the vehicles / vehicles in all wavelength ranges where such sensor systems operate. WO / 2010/093323 A1 discloses a device for thermal adaptation, comprising at least one surface element arranged to assume a certain thermal distribution, wherein said surface element comprises a first heat-conducting layer, a second heat-conducting layer, wherein said first and second heat-conducting layers are embedded heat insulated by means of an intermediate insulating layer, wherein at least one thermoelectric element is provided arranged to generate a predetermined temperature gradient to a portion of said first layer. The invention also relates to an object such as a vehicle. This solution only allows thermal signature adaptation and is not suitable for application to objects, such as vehicles / vehicles, which by design shell do not allow storage of excess heat from the said at least one thermoelectric element.
OBJECT OF THE INVENTION An object of the present invention is to provide a device called signature fitting which handles thermal signature fitting and is suitable for application to vehicles / vessels, such as marine vehicles.
A further object of the present invention is to provide a device for thermal signature matching which enables the provision of active thermal camouflage with the desired thermal structure. A further object of the present invention is to provide a device for thermal and radar / visual camouflage which enables the provision of automatic thermal adaptation of surroundings and active visual adaptation and / or passive radar adaptation and enables the creation of an uneven thermal / visual structure. Another object of the present invention is to provide a device for thermally imitating, for example, other vehicles / vehicles in order to achieve identification of own troops by thermal and / or radar signature or to provide opportunities for infiltration by thermal or radar signature adaptation in or around e.g. enemy troops under appropriate conditions.
SUMMARY OF THE INVENTION These and other objects, which appear from the following description, are achieved by means of a device for signature adaptation and for objects and which further have the features set forth in the characterizing part of the appended claims 1 and 26, respectively. Preferred embodiments of the device and method are defined in appended dependent claims 2-25. According to the invention, the objects are achieved with a device for signature adaptation, comprising a surface element arranged to assume a certain thermal distribution, said surface element comprising at least one temperature generating element arranged to generate at least a predetermined temperature gradient to a portion of a first heat conducting layer 15 of said surface element. said device for signature adaptation comprising a water cooling element arranged to provide at least a water flask, thermally contacting an inner portion of said at least one temperature generating element so that heat energy is conducted away from said at least one temperature generating element.
This enables effective thermal adaptation where application is possible on objects comprising a surface structure, such as e.g. a surface structure comprising sandwhich material, which is commonly found in marine vessels. A particular application of the present invention is thermal adaptation for camouflage of, for example, military vehicles / vehicles, where the said at least one temperature generating element enables effective thermal adaptation so that dynamic thermal signature adaptation can be maintained during refurbishment of the vehicle. According to an embodiment of the device, said liquid cooling element is configured for connection to at least one pump (PU) arranged to supply at least one liquid flow to said liquid cooling element.
According to an embodiment of the device, said surface element comprises a plurality of temperature generating elements, each arranged to generate at least one predetermined temperature gradient to a portion each of said first heat conductive layer of said surface element. This enables fast and efficient adaptation of a large surface, which means that the surface elements can be constructed larger, or thermal adaptation for smaller surface elements can take place more quickly. According to an embodiment of the device, said water cooling element comprises a water cooling element layer, which forms part of the water cooling element and wherein said water cooling element layer is arranged below said first thermally conductive layer, said water cooling element layer comprising a plurality of temperature apertures. elements thermally contact a portion of a hot plate structure, applied to and underlying said water cooling element layer and arranged to dissipate the heat from said plurality of temperature generating elements in a direction along the surface of the hot plate structure. According to an embodiment of the device, said water cooling element comprises a water cooling plate and wherein said water cooling plate is arranged to be thermally applied to a portion of said hot plate structure.
According to an embodiment of the device, said plurality of apertures of the water cooling element layer are arranged in a geometric sample in the form of a plurality of rows and wherein said hot plate structure comprises a plurality of hot plates, arranged to be applied to the water cooling element layer so that each of the hot plates. multiple rows of apertures of the water cooling element layer.
According to one embodiment of the device, the hot plate structure comprises a transverse hot plate arranged to thermally contact a central portion of each of said plurality of hot plates and wherein said water cooling plate is arranged to be applied to said transverse hot plate.
According to an embodiment of the device 8, said water cooling element is configured for connection to said At least one pump via at least one line arranged for transporting said at least one water floc.
According to an embodiment of the device, the said float comprises at least one cooling medium 6 at least one cooling medium.
According to one embodiment of the device, the at least one cooling medium comprises water.
According to an embodiment of the device, narrinda liquid cooling elements are arranged to be supplied with said at least one liquid floc from at least one reservoir (RE) comprising coolant.
According to an embodiment of the device, the said constitutes at least one reservoir (RE) of seawater or seawater.
According to an embodiment of the device, said surface element comprises at least one display surface arranged to emit at least one hazardous spectrum. By providing said surface element with a display surface arranged to emit at least a predetermined spectrum, in addition to camouflage within the infrared range of the total electromagnetic spectrum, camouflage within the visual range, i.e. the area visible to the human eye. According to an embodiment of the device, said at least one display surface comprises a plurality of sub-display surfaces, wherein the sub-display surfaces are arranged to emit at least one predetermined spectrum in at least one predetermined direction, wherein said at least one predetermined spectrum is direction-dependent. By emitting at least one predetermined spectrum in a plurality of predetermined directions, it is possible to correctly recreate perspectives of visual background objects by reproducing different spectra (patterns, color) in different directions, which means that a viewer, regardless of relative position, sees a correct perspective of said visual background objects.
According to an embodiment of the device, said at least one predetermined direction of the usual sub-display surface is individually offset relative to an orthogonal axis of said display surface. By providing a plurality of sub-display surfaces, it is possible to reproduce several direction-dependent spectra by means of one and the same display surface, since the usual sub-display surface can be regulated individually.
According to an embodiment of the device, the at least one display surface comprises an obstructing layer arranged to obstruct incident light of selected angles of incidence and an underlying curved reflecting layer arranged to reflect incident light. By providing obstructive layers in combination with an underlying curved reflective layer, it is possible to merge several direction-dependent spectra by means of one and the same display surface in a cost-effective manner. For example, said obstructing layer can be easily constructed of flexible thin film. Furthermore, it is possible that spectra intended for Merges at a certain angle or angle range do not become visible from viewing angles which fall outside said angle or angle range, thanks to said obstructing layer.
According to an embodiment of the device, the surface element comprises at least according to further elements arranged to provide radar suppression. By providing said surface element with an element arranged to provide radar suppression, in addition to camouflage within the infrared range of the total electromagnetic spectrum, camouflage within the area within which radar systems operate is made possible. According to an embodiment of the device, said surface element comprises a further reinforcing element arranged to provide reinforcement. By providing at least one further element arranged to provide reinforcement, in addition to a device with increased robustness, it is also possible for a modular armoring system where individual forged surface elements arranged in vehicles can be easily and cost-effectively replaced.
According to an embodiment of the device, said first heat-conducting layer has anisotropic heat conduction so that heat conduction takes place mainly in the main extension direction of the layer. Due to the anisotropic layer, fast and efficient transport of heat and consequently fast and efficient thermal adaptation is possible. With an increasing ratio between heat conduction in the main extension direction of the layer and heat conduction across the layer, it is possible for a device with, for example, several composite surface elements to have the temperature generating elements arranged at a greater distance from each other, which results in cost-effective composition of surface elements. By increasing the ratio between the heat conduction shape along the layer and the heat conduction shape across the layer, the layers can be made thinner and arida obtain the same effect, alternatively the layer and thus the surface element faster. If the layers become thinner while maintaining efficiency, they will also be cheaper and lighter. Furthermore, a more even distribution of heat in layers directly below the display surface is made possible, which greatly reduces the possibility that any hot-spots in the underlying layers affect the display surface's ability to correctly merge spectrum in a correct manner.
According to an embodiment of the device, the surface element comprises an intermediate heat-conducting element arranged against and underlying the temperature-generating element, the intermediate heat-conducting element having anisotropic heat conduction so that heat conduction takes place substantially across the main direction of extension of the first heat-conducting layer. This enables fast and efficient transport of heat energy from the 8 temperature generating element down to the underlying layers / structures as well as down to the water cooling plate via the hot plate structure.
According to an embodiment of the device, said surface element has a hexagonal design. This enables simple and general adaptation and assembly when assembling surface elements to a modular system. Furthermore, an even temperature can be generated on the entire hexagonal surface, whereby local temperature differences which may arise in horns of, for example, a square-shaped modular element are avoided.
According to an embodiment of the device, the device comprises a thermal sensing means arranged to sense ambient temperature, for example thermal background. This provides information for adjusting the surface temperature of surface elements. A thermal sensing means such as an IR camera provides an almost perfect adaptation to the background where a background temperature variation can be observed on, for example, a vehicle arranged with several composite surface elements. The resolution of the IR camera can be arranged to correspond to the resolution that the resolution of the composite surface elements of the device can merge, i.e. each surface element corresponds to a number of grouped camera pixels. As a result, a very good reproduction of the background temperature is obtained, so that, for example, solar heating, snowflakes, water bodies, different emission properties, etc. of the background, which often has a different temperature than the air, can be Merges correctly. This effectively counteracts the creation of clear contours and large evenly warm surfaces so that when the device is arranged on a vehicle a very good thermal camouflage of the vehicle is possible.
According to an embodiment of the device, the device comprises a visual scanning means arranged to scan the visual background of the surroundings, for example visual structural background. This provides information for adapting the output at least according to the spectrum from said at least one display surface of surface elements. A visual sensing means such as a video camera provides an almost perfect fit to the background where a background visual structure (color, monster) can be merged on, for example, a vehicle arranged with several composite surface elements.
According to an embodiment of the device, the device comprises a plurality of surface elements, the liquid cooling element of each of said plurality of surface elements being connected in parallel across at least one line for inflow of said at least one liquid flow and to at least one line for outflow of said liquid at least one liquid. This enables rapid and efficient cooling of the temperature-generating element or the temperature-generating elements of said plurality of surface elements with a minimum number of lines for liquid flow.
According to an embodiment of the device, the device comprises a framework or support structure, wherein the framework or support structure is arranged to support a plurality of joined surface elements and to provide all current and control signals / communication to said plurality of joined surface elements. Because the framework itself is arranged to supply current, the number of cables can be reduced.
DESCRIPTION OF THE DRAWINGS The present invention will be better understood by reference to the following detailed description of the drawings taken in conjunction with the accompanying drawings, in which like reference numerals appear in like manner throughout throughout the many views, and in which: Fig. 1a schematically illustrates in an exploded perspective view different layers of a part of a device according to an embodiment of the present invention; Fig. 1b schematically illustrates in an exploded side view different layers of a part of a device in Fig. 1a; Fig. 1c schematically illustrates a block diagram of a part of a signature matching device according to an embodiment of the present invention; Fig. 1d schematically illustrates in an exploded perspective view different layers of a part of a device according to an embodiment of the present invention; Fig. 1e schematically illustrates the flow in the device of Fig. 1c; Fig. 2a schematically illustrates in an exploded perspective view seen obliquely from above 5 different layers of a part of a device according to an embodiment of the present invention; Fig. 2b schematically illustrates in an exploded perspective view seen obliquely below from below different layers of a part of a device according to an embodiment of the present invention; Fig. 2c schematically illustrates in a plan view different layers of a part of a device according to an embodiment of the present invention; Fig. 2d schematically illustrates in a plan view different layers of a part of a device according to an embodiment of the present invention; Fig. 3a schematically illustrates in a perspective view a part of a device according to an embodiment of the present invention; Fig. 3a schematically illustrates in a side view a part of a device according to an embodiment of the present invention; Fig. 4 schematically illustrates the signature adaptation device arranged on a hazard template such as a vessel, according to an embodiment of the present invention; Fig. 5a schematically illustrates in an exploded perspective view different layers of part of a device for thermal adaptation according to an embodiment of the present invention; Fig. 5b schematically illustrates in an exploded side view different layers of a part of a device for thermal adaptation according to an embodiment of the present invention; Fig. 6 schematically illustrates a signature matching device according to an embodiment of the present invention; Fig. 7a schematically illustrates in a side view a type of display layer of a part of a device according to an embodiment of the present invention; Fig. 7b schematically illustrates in a side view a type of display layer of a part of a device according to an embodiment of the present invention; Fig. 7c schematically illustrates in a plan view a part of a display layer of a part of a device according to an embodiment of the present invention; Fig. 7d schematically illustrates in a side view a display layer according to an embodiment of the present invention; Fig. 7e schematically illustrates in a plan view parts of a display layer according to an embodiment of the present invention; Fig. 8a schematically illustrates in an exploded side view different layers of a part of a device according to an embodiment of the present invention; Fig. 8b schematically illustrates in an exploded side view different layers of a part of a device according to an embodiment of the present invention; Fig. 8c schematically illustrates in a plan view different layers of a part of a device according to an embodiment of the present invention; Fig. 8d schematically illustrates in a plan view the river in different layers of a part of a device according to an embodiment of the present invention; Fig. 9 schematically illustrates a plan view of a device according to an embodiment of the present invention; Fig. 10 schematically illustrates a signature fitting device according to an embodiment of the present invention; Fig. 11a schematically illustrates a plan view of a modular system comprising elements for all recreating thermal backgrounds or the like; Fig. 11b schematically illustrates an enlarged part of the modular system in Fig. 11a; Fig. 11c schematically illustrates an enlarged part of the part in Fig. 11b; Fig. 11d schematically illustrates a plan view of a modular system comprising elements for recreating thermal and / or visual background or the like according to an embodiment of the present invention; Fig. 11e schematically illustrates in a side view the modular system of Fig. 11d; Fig. 12a schematically illustrates in an exploded perspective view a modular system according to an embodiment of the present invention; Fig. 12b schematically illustrates in an exploded partially cut perspective view the module system of Fig. 12a; Fig. 12c schematically illustrates in a side view a part of a device according to an embodiment of the present invention; Fig. 13 schematically illustrates an object such as a vehicle exposed to threats in a threatening direction, where the thermal and / or visual structure of the background is recreated by means of a device according to the present invention on the side of the vehicle facing the threatening direction; and Fig. 14 schematically illustrates various potential threat directions for a feremal such as a vehicle equipped with a device for recreating the thermal and / or visual structure of the desired background.
DETAILED DESCRIPTION OF THE INVENTION He had the term "lank" for a communication link which may be a physical line, such as an optoelectronic communication line, or a non-physical line, such as a wireless connection, for example a radio or microwave line.
In the embodiments of the present invention described below, radio waves are within the electromagnetic spectrum typically used by radar systems. Radio waves can also refer to pulses of radio waves or microwaves as above.
In the embodiments of the present invention described below, temperature generating element means an element by means of which a temperature can be generated.
In the embodiments of the present invention described below, thermoelectric element means an element by means of which Peltier effect is achieved when voltage / current is applied thereto.
In the embodiments of the present invention, the terms temperature generating element and thermoelectric element are used interchangeably to describe an element by means of which a temperature can be generated. Said thermoelectric element is intended to refer to an example of a temperature generating element.
In the embodiments of the present invention described below, spectrum refers to one or more frequencies or wavelengths of straining produced by one or more light sources or one or more reflecting surfaces.
Thus, the term spectrum is intended to refer to frequencies or wavelengths which are not only within the visible range but also within the infrared range, the ultraviolet range or other ranges of the total electromagnetic spectrum. Furthermore, a given spectrum can be of the narrowband or broadband type, i.e. comprise a relatively small number of frequencies / wavelength components or comprise a relatively large number of frequencies / wavelength components. A given spectrum can also be the result of a mixture of several different spectra, ie. comprise a plurality of spectra emitted from a plurality of light sources or a plurality of reflecting surfaces. In the embodiments of the present invention described below, color refers to a property of emitted light in terms of how an observer perceives the emitted light. Thus, different colors implicitly refer to different spectra that include different frequencies / wavelength components. Thermal camouflage systems based on prior art thermoelectric elements typically include flake form of heat exchanger functionality. This is because thermoelectric elements risk fatigue during operation if sufficient cooling is not available.
According to WO / 2010/093323 A1, this heat exchanger functionality consists of passive heat exchanger functionality in the form of utilizing the heat conduction shape of the material of the object on which the signature adjusting device is arranged to be mounted. In more detail, the chassis / hull of the object on which the signature adapter is arranged to be mounted is used for storage of excess heat generated by thermoelectric elements. However, this requires that the surface material of the object has good heat-conducting properties. A problem with prior art is that it is not suitable for application to objects which have surface materials in the form of materials with very thermal conductive properties. This applies to special objects such as vehicles / vehicles where the hull / chassis includes material with a layer of thermal conductivity, such as e.g. marine vessels having hulls including sandwich materials, such as e.g. sandwich material with a core of polyvinyl chloride (PVC) lined with carbon fiber laminate.
Fig. 1a schematically illustrates in an exploded perspective view of a part I of a device for signature adaptation according to an embodiment of the present invention.
Fig. 1b schematically illustrates in an exploded side view the part I of the device for signature adaptation according to an embodiment of the present invention.
The signature matching device includes a surface member 100A. Said surface element 100A comprises at least one temperature generating element 150 arranged to generate at least one predetermined temperature gradient. The at least one temperature generating element 150 is arranged to generate said predetermined temperature gradient to a portion of said surface element 100. In more detail, an outer surface 150: A of said at least one temperature generating element 150 is arranged to generate said predetermined temperature gradient to a portion of said surface element 100A. Furthermore, said 6 at least one surface element 100A 6 comprises at least one liquid cooling element LCE configured for thermal contact with said at least one temperature generating element 150. In more detail, said at least one water cooling element is configured for thermal contact with an inner surface 150: B of said at least one temperature generating element 150. By enabling at least one liquid cooling element configured for thermal contact with an inner surface 150: B of said at least one temperature generating element 150, it is possible to transport heat away from said inner surface of said at least one temperature generating element 150 and supply cooling to said inner surface. of said 6 at least one temperature generating element 150, as illustrated with continued reference to Fig. 1 b, where heat transport is illustrated with white arrows A or unfilled arrows A and transport of cold is illustrated with black arrows B or filled arrows B, where transport of cold physically meant b transfer of heat that has the opposite direction to the direction of transport of cold.
According to one embodiment, said surface element 100A comprises a first thermally conductive layer 80. According to this embodiment, said at least one temperature generating element 150 is applied to a portion on the underside of said first thermally conductive layer 80. By said at least one temperature generating element 150 applied to a portion of a layer which is heat conductive, in the form of said first heat conductive layer 80, enables the predetermined temperature gradient to be spread over the surface of the first heat conductive layer 80 so as to provide an adapted thermal signature exterior to the environment. According to this embodiment, said outer surface 150: A of said at least one temperature generating element 16 is arranged to be applied to the inner portion of the first heat conducting layer 80.
The temperature generating element 150 is constituted according to an embodiment of at least one thermoelectric element.
According to one embodiment, the thermoelectric element 150 is a semiconductor operating according to the Peltiere effect. The Peltier effect is a thermoelectric phenomenon that occurs when a direct current is allowed to flow over different metals or semiconductors. In this way, a heat pump can be created that cools one side of the element and heats the other. The thermoelectric element includes two ceramic plates with high thermal conductivity. The thermoelectric element according to this variant further comprises semiconductor rods which are positively doped in one spirit and negatively doped in another spirit so that when a current flows through the semiconductors electrons are forced to flow so that one side becomes hotter and the other colder (deficit of electrons). When changing the tension direction, ie. at the second polarity of the applied voltage, the effect becomes the reverse, ie. the other side gets hot and the first cold. This is the so-called Peltier effect, which is consequently used in the present invention.
According to one embodiment, the first heat-conducting layer 80 has an anisotropic heat-conducting shape, so that all the heat-conducting shape in the main extension direction of the layer 80, i.e. along the layer 80 is substantially higher than the thermal conductivity of the transverse layer 80. As a result, heat or cold can be spread rapidly over a large surface with relatively few thermoelectric elements, whereby temperature gradients and "hot spots" are reduced. The first heat conductive layer 80 is formed according to an embodiment of graphite.
According to a variant, the graphite layer 80 has a composition such that the heat conduction shape along the graphite layer is in the order of 300-2500 W / mK and the heat conduction shape across the graphite layer is in the order of 1-30 W / mK. Fig. 1c schematically illustrates a block diagram of a part 11 of the signature matching device according to an embodiment of the present invention.
The at least one water cooling element LCE 5r is configured for connection through at least one line L1, L3 via at least one pump PU to at least one reservoir RE. The at least one pump is arranged to provide an at least one water flow from said at least one reservoir to said at least one water cooling element. In more detail, said at least one pump PU is configured for connection to a reservoir RE by at least one first line L1, arranged for transporting said at least one water plate from said at least one reservoir to said at least one pump. Said at least one pump is further configured for connection to said at least one water cooling element by at least a second line L2 arranged for transporting said at least one water flow from said at least one pump to said at least one water cooling element. The at least one water cooling element is further configured for connection to at least a third line L3 for transporting said at least one water flow away from said at least one water cooling element, such as for transport to the environment or for transport back to said at least one reservoir. The at least one reservoir comprises at least one liquid coolant. The at least one liquid refrigerant may comprise one or more substances as at least one substance of the following group of substances: water, oil, dielectric liquid, polyalphaolefin (PAO), ethylene glycol or other substance suitable for use as a refrigerant. The at least one cooling medium may also comprise a mixture of a plurality of the above-mentioned substances. The at least one liquid refrigerant may also comprise additional additives suitable for imparting various types of properties to the at least one refrigerant such as corrosion protection, antifreeze, flame retardant, etc. Preferably, said at least one liquid refrigerant comprises water. The at least one pump is further configured for connection to at least one pump control circuit PCC, arranged for controlling the at least one pump to enable control of the at least one water flow. Named at least one pump control circuit can e.g. consists of a 5 PID control circuit or other type of suitable control circuit. The at least one pump control circuit PCC may also be configured for connection to one or more PTS sensors for temperature and / or river supply. Said one or more sensors may be arranged to provide input data to said at least one pump control circuit to enable said at least one pump control circuit to calculate control data for controlling said at least one pump in order to control said at least one liquid flow depending on said input data. For example, at least one temperature sensor PTS, configured for connection to said at least one pump control circuit, may be arranged to supply all the temperature of said at least water cooling element or of said inner surface 150: B of said at least one temperature generating element 150. For example, said sensor PTS may be a temperature sensor 210 as exemplified with reference to Fig. 10.
According to one embodiment, each of said at least one first, second and third conduit, arranged for conduction / transport of liquid flow, consists of at least one pipe, at least one hose or other suitable channel for conduction of liquid flow.
According to one embodiment, in those cases where the device for signature adaptation is intended for application to a marine vessel, said reservoir consists of sea or sea water. According to this embodiment, said at least one pump is arranged to create an inflow of sea or sea water through a conduit for inflow located below the waterline of the vessel on which said device for signature adaptation is intended to be placed. Furthermore, according to this embodiment, the effluent from said at least one water cooling element is arranged to be carried back to the sea or the sea. Fig. 1d schematically illustrates in an exploded perspective view a part III of a device for signature adaptation according to an embodiment of the present invention.
The device comprises a surface element 100B comprising an enclosure housing 510, a first heat conductive layer 80, a water cooling element layer LCEL and a hot plate structure HPS, wherein the heating plate structure HPS and the water cooling element layer form parts of a water cooling element, as shown in Fig. 1. 1b and Fig. 1c. The surface element 100B further comprises at least one temperature generating element 150 arranged to generate at least one predetermined temperature gradient. The temperature generating element 150, for example formed by a thermoelectric element 150, is arranged to generate said predetermined temperature gradient to a portion of said first thermally conductive layer 80. The surface element 100B is further arranged to comprise a control circuit, such as a control circuit 200 exemplified with reference to Fig. 6. which is arranged to be electrically / communicatively connected to the temperature generating element 150, wherein the control circuit 200 is arranged to provide control signals related to the at least one predetermined temperature gradient. The water cooling element layer LCEL is arranged as an insulating layer. The water cooling element layer LCEL further comprises an aperture AP, arranged to receive the temperature generating element 150 or the temperature generating element 150 and the intermediate heat conducting element 160. The water cooling element layer LCEL is arranged to be applied to the first heat conducting layer 80. In more detail, the water cooling element the first heat-conducting layer.
The hot plate structure HPS is arranged to be applied to the water cooling element layer. In more detail, the hot plate structure HPS is arranged below the water cooling element layer LCEL and the overlapping aperture AP of the water cooling element layer LCEL, i.e. arranged on a surface of the liquid cooling element layer LCEL which is opposite to the surface arranged to be applied to the first heat conducting layer 80. This means that the hot plate structure HPS can thermally contact the temperature generating element 150. The hot plate structure is arranged to dissipate heat energy from the temperature direction 150. along the surface of the hot plate structure H PS.
According to one embodiment, the hot plate structure HPS is arranged over a larger surface of the water cooling element layer LCEL than the surface formed by the aperture AP. This creates a larger effective surface against which a cooling element, such as a cooling plate LCP exemplified by reference to Figs. 1e, 3a-3c, can be applied to provide cooling of the temperature generating element 150, as illustrated in more detail in Figs. . smile.
The surface element 100B according to this embodiment comprises a housing cover 510. The housing housing 510 is arranged as an outer protective housing. The encapsulation housing 510 is arranged to be applied by means of a bandage, such as by a tight-fitting bandage to one or more structures and / or elements of a platform or an object which is desired to be hidden by the thermal adaptation which is carried out by the system. The housing cover 510 may also be arranged to be fitted by a joint, such as by a tight-fitting joint against or against a framework / support element, such as a support element exemplified with reference to Fig. 12a, where the support element is arranged to be mounted on a platform or object Desired is hidden by the thermal adaptation made possible by the system. The housing cover 510 forms a substantially tight-fitting enclosure of the first heat-conducting layer 80, the water cooling element layer LCEL, the control circuit 200, the intermediate heat-conducting layer, the hot plate structure HPS and the temperature generating element 150. The housing housing 510 is arranged to be heat-conducting.
According to one embodiment, the housing 510 is made of a corrosion-resistant and heat-conducting material, such as aluminum. According to an embodiment of the device according to the invention, the housing 510 of the surface element is arranged to be waterproof to enable marine application areas where the surface elements are mounted on structures coated below and or above the waterline of a marine vessel. In detail, the housing cover is arranged to enclose elements / layers of the surface element so that these are protected against exposure to water.
The first thermally conductive layer 80 is arranged inside the first encapsulation element 510.
The first thermally conductive layer 80 has anisotropic thermal conductive shape so that the thermal conductive layer in the main extension direction of the layer 80, i.e. along the layer 80 is substantially higher than the thermal conductivity of the transverse layer 80. As a result, heat or cold can be spread rapidly over a large surface with relatively few thermoelectric elements, whereby temperature gradients and "hot spots" are reduced. The first thermally conductive layer 80 is formed according to a graphite formulation.
The temperature generating element 150 is according to one embodiment arranged in the liquid cooling element layer LCEL. In more detail, the temperature generating element 150 is arranged immersed in an aperture AP arranged on the water cooling element layer LCEL. The temperature generating element 150 is configured so that when a voltage is connected, i.e. a current is supplied to the temperature generating element 150, the heat from one side of the temperature generating element 150 passes to the other side of the temperature generating element 150. The temperature generating element 150 is consequently arranged between two heat conducting layers / structures 80, HPS, for example a graphite layer , with asymmetric heat conduction shape to efficiently dissipate and evenly distribute heat or cold and a hot plate structure HPS, arranged for transporting heat output by phase change in a liquid medium. Thanks to the combination of the heat-conducting layer 80, with anisotropic heat-conducting shape, the hot plate structure HPS, arranged for transporting heat output by phase change in a liquid medium, the water cooling element layer LCEL, with insulating properties and a cooling plate, as a cooling plate LCP exemplified by reference to LCP. 3a, by applying tension to the temperature generating element, the surface 102 of the surface element 100B, which according to this embodiment is constituted by the surface of the first heat-conducting layer 80, can be thermally adapted quickly and efficiently. Furthermore, the surface of the enclosure housing 150 can thereby also be thermally adapted quickly and efficiently as it is heat conductive and applied to the first heat conductive layer 80. The temperature generating element 150 is in thermal contact with the first heat conductive layer 80 and the hot plate structure 10 HPS.
According to one embodiment, the device comprises an intermediate heat conducting element 160 arranged in the liquid cooling element layer LCEL, inside the temperature generating element 150 to fill any space between the thermoelectric element 150 and the hot plate structure 15 HPS. This said that heat conduction can take place more efficiently between the temperature generating element 150 and the hot plate structure HPS. The intermediate heat-conducting element has an anisotropic heat-conducting capacity where the heat-conducting element is substantially better across the element along, i.e. conducting heat substantially better across the layers of the surface member 100B. Della is shown in Fig. 1c. According to one embodiment, the intermediate thermally conductive element 160 is made of graphite having the same properties as the first thermally conductive layer 80 but with anisotropic thermal conductivity in a direction perpendicular to the thermal conductivity of the first thermally conductive layer 80. According to one embodiment, the intermediate thermally conductive element 160 is arranged in a aperture AP arranged to receive said intermediate heat conducting element 160. Said aperture AP is arranged to pass through the water cooling element layer LCEL.
Furthermore, the liquid cooling element layer LCEL could be fitted in thickness 30 with the temperature generating element 150 or the temperature generating 23 element 150 and the intermediate heat conducting element 160 so that there is no space between the temperature generating element 150 and the hot plate structure HPS or saying that there is no space between the intermediate heat conducting element 160 and the hot plate structure HPS.
According to one embodiment, the first heat-conducting layer 80 has a thickness in the range 0.1-2 mm, for example 0.4-0.8 mm, where the thickness depends, among other things, on application and the desired thermal conductivity and efficiency. According to one embodiment, the second heat-conducting layer 120 has a thickness in the range 0.1-3 mm, for example 0.4-0.8 mm, where the thickness depends, among other things, on application and the desired thermal conductivity and efficiency.
According to one embodiment, the liquid cooling element layer LCEL has a thickness in the range 1-30 mm, for example 10-20 mm, where the thickness depends, among other things, on application and the desired efficiency. According to one embodiment, the temperature-generating element 150 has a thickness in the range 1-20 mm, for example 2-8 mm, according to a variant around 4 mm, where the thickness depends, among other things, on application and desired thermal conductivity and efficiency. According to one embodiment, the thermoelectric element has a surface in the order of 0.01 mm2-200 cm2. According to one embodiment, the temperature-generating element 150 has a square or other arbitrary geometric shape, for example hexagonal shape.
The intermediate heat conducting element 160 has a thickness which is adjusted so as to fill the gap between the temperature generating 150 and the hot plate structure HPS. According to one embodiment, the intermediate thermally conductive element has a thickness in the range 5-30 mm, for example 10-20 mm, according to a variant around 15 mm, where the thickness depends, among other things, on application and desired thermal conductivity and efficiency. According to one embodiment, the housing cover 510 has a thickness in the range 0.2-4 mm, for example 0.5-1 mm and depends, among other things, on application and efficiency.
The surface of the surface element 100B is according to an embodiment in the range 25-8000 5 cm, for example 2000-6000 cm 2. According to a construction form, the thickness of the surface element is in the range 5-60 mm, for example 10-20 mm, where the thickness depends, among other things, on application and desired heat conduction and efficiency.
Fig. 1e schematically illustrates the Widen in a side view of the part III of a device for signature adaptation according to an embodiment of the present invention. The device comprises a surface element 100B arranged to assume a permanent thermal distribution, said surface element comprising an enclosure housing 510 a first heat conductive layer 80, an intermediate heat conductive element 160, a hot plate structure, a water cooling plate LCP, said first heat conductive layer and the said thermal conductive layer. Heat insulated by means of a water cooling element layer LCEL with insulating properties, and a temperature generating element 150 arranged to generate a predetermined temperature gradient to a portion of said first heat conductive layer 80.
As shown in Fig. 1e, the heat is transported from one side of the temperature generating element 150 and passes to the other side of the thermoelectric element and further through the intermediate heat conducting element 160, where heat transport is illustrated by white arrows A or unfilled arrows A and transport of refrigeration is illustrated by black arrows B or filled arrows B, where transport of refrigeration physically involved the removal of heat which has the opposite direction to the direction of transport of refrigeration. If all the first heat-conducting layer 80 is visible, which according to one embodiment consists of graphite, has anisotropic heat-conducting shape, so all the heat-conducting shape in the main extension direction of the layer 80, i.e. along the layer is substantially higher than the thermal conductivity across the layer.
As a result, heat or cold can be spread rapidly over a large area with relatively few thermoelectric elements and relatively low supply power, whereby temperature gradients and "hot spots" are reduced. Furthermore, even and constant desired temperature can be kept at the surface for a long time. Heat is further passed through the hot plate structure HPS and the liquid cooling plate LCP, which forms part of a liquid cooling element, such as a liquid cooling element configured for connection to a pump and a reservoir as described in Fig. 1c, where a liquid flow is created which comprises a cooling medium. through the liquid cooling plate LCP, heat is dissipated from the heating plate structure HPS and thereby also the temperature-generating element.
Heat is further conducted from the first heat conductive layer 80 up into the enclosure housing 510.
Fig. 2a schematically illustrates in an exploded perspective view seen obliquely from above 15 of a part IV of a device for signature adaptation according to an embodiment of the present invention.
Fig. 2b schematically illustrates in an exploded perspective view seen from below of the part IV illustrated in Fig. 2a of a device for signature adaptation according to an embodiment of the present invention.
With reference to Fig. 2a and Fig. 2b, according to one embodiment, said signature matching device comprises a surface element 100C comprising a plurality of temperature generating elements 150: 5, 150: 6 and 150: 7, each arranged to generate at least one predetermined temperature gradient to a portion each of the surface element 100C. Preferably, said plurality of temperature generating elements are arranged all applied to a plurality of portions of the first heat conducting layer 80 so that these plurality of portions are evenly distributed at the surface of the first heat conducting layer. In more detail, said plurality of temperature generating elements 150: 5, 150: 6 and 150: 7 are arranged to generate at least one predetermined temperature gradient to 26 a portion each of the surface element 100C, as to a portion each of the first thermally conductive layer 80. each of said plurality of temperature generating elements 150: 5-150: 7 cooperates to control the temperature of the first thermally conductive layer 80 so that it is possible that the temperature can be regulated more quickly and / or that the outer layer can be made larger compared to using a temperature generating element. The surface element 100C further comprises a water cooling element layer LCEL, which forms part of a water cooling element LCE, as a part of said water cooling element LCE illustrated with reference to any of Figs. 1a-c. The water cooling element layer is arranged to be applied to the first heat-conducting layer 80. In more detail, said water cooling element layer comprises a plurality of apertures A1, A2, A3, as well as a plurality of apertures of fully or partially continuous water cooling element layer LCEL. Said plurality of apertures are adapted in number to the number of temperature generating elements 150: 5-150: 7 and arranged to receive said plurality of temperature generating elements. This so that the water cooling element layer can be applied to the first heat conducting layer 80 surrounding the plurality of temperature generating elements. The water cooling element layer LCEL includes materials with good thermal insulation form6ga e.g. in the form of molded plastic such as e.g. polyurethane. The water cooling element layer LCEL comprises at least one hot plate so-called "Heat pipes", which forms part of a hot plate structure HPS, as a hot plate structure HPS exemplified with reference to Fig. 2d. Said hot plate structure is arranged to be applied to a underside of the water cooling element layer, i.e. a side of the water cooling element layer opposite the side of the water cooling element layer arranged to be applied to the first heat conducting layer 80. In more detail, each of said hot plate structure is arranged to be applied to a underside of the water cooling element layer LCEL so that at least one of at least one hot plate structure thanks to the plurality of apertures provided in the water cooling element layer. This causes the temperature generating element of said plurality of temperature generating elements to thermally contact at least one part of the hot plate structure. Said hot plate structure is arranged 27 for transporting heat from said four temperature generating elements. In more detail, said hot plate structure is arranged for transporting heat from a surface of said at least one temperature generating element 150 in the form of said inner surface 150: B exemplified with reference to Fig. 1 b.
The hot plate structure is arranged to transport thermal energy supplied to the hot plate structure along the extent of the surface of the hot plate structure. This is done by rapidly distributing thermal energy (heat, cooling) to one or more patches of the hot plate structure over its entire extent. According to one embodiment, the at least one hot plate of the hot plate structure is configured as a self-contained thermodynamic machine for transporting heat output by means of phase change in a liquid medium. In more detail, the heating plate can be built around a base in the form of a metal tube, such as a metal tube of copper. An inner cradle of the metal tube 15 is lined with material that acts as a wick. The wick is matted with a liquid, usually water. The tube is otherwise dry on atmosphere (vacuum pumped), and taken closed. The wick is matted with a liquid, such as e.g. water. The metal pipe is otherwise dry on atmosphere (vacuum pumped), and taken sealed. DO heat is supplied from outside in an area of the pipe, the liquid in the wick at this point begins to evaporate, as the negative pressure in the pipe lowers the boiling point of the water. The phase change from liquid to gaseous binds heat energy. The steam formation creates a local overpressure in the hot area, and the steam is transported at high speed to the cold areas of the river, where there is still a low pressure. There, the liquid condenses back into the wick, releasing 25 armed heat that it has bound. The fluid is then drawn back to the warm area by capillary action in the wick, and the cycle begins again. The effect of this is that all the heating plate constantly strives to become isothermal over its entire length, and that it can transport heat with very high power. In more detail, the pressure in the said at least one hot plate is relatively laid, so that the specific pressure of the liquid causes the liquid in the wick to evaporate at the point where heat is applied. In this case, the vapor has a substantially higher pressure than its surroundings, which means that it spreads rapidly to all areas with lower pressure, in which areas it condenses into the wick and emits its energy in the form of heat. This process is continuous until an equilibrium pressure is created. This process is simultaneously reversible so that also cooling, ie. lack of heat, can be transported under the same principle. The heating plate is also completely self-closing, ie. has no gaskets, joints, valves, couplings or anything else that can run paint, and also requires no external power source, except that the hot hot plate itself must transport. Said at least one hot plate comprises according to a variant sealed aluminum or copper with internal capillary surfaces in the form of wicks, where the wicks according to a variant consist of sintered copper powder. According to a variant, the wick is matted with liquid which during various processes is either evaporated or condensed. The type of liquid and wick is determined by which temperature range 15 grids and determines the thermal conductivity.
The advantage of using a hot plate is that it has a very efficient thermal conductivity, significantly higher than, for example, ordinary copper. The ability to transport heat, so-called Axial Power Rating (APC), is caused by the length of the rudder and increases by its diameter. The heating plate 20 allows rapid dissipation of excess heat from the underside of the temperature generating elements to the underlying layer, as to a water cooling plate exemplified with reference to Fig. 3a, due to their good ability to distribute the heat over large areas. Through the hot plate, rapid dissipation of excess heat is possible, which is required, for example, under certain solar conditions. Due to the rapid dissipation of excess heat, efficient operation of each of the plurality of temperature generating elements 150: 5-150: 7 is possible, which enables efficient thermal adaptation of the environment continuously.
Fig. 2c schematically illustrates in a plan view of a part V of a device for signature matching according to an embodiment of the present invention. According to an embodiment sa, said device for signature adaptation comprises a water cooling element layer LCEL, such as a water cooling element layer LCEL according to the flag of Fig. 2a and / or Fig. 2b, comprising a plurality of apertures A1-A3, B1-B4, C1-05, D1-D4. E1-E3 are each arranged to receive after temperature generating elements of said plurality of temperature generating elements, as said plurality of temperature generating elements exemplified with reference to Fig. 2a and / or Fig. 2b. According to this embodiment, the plurality of apertures are arranged in a geometric pattern in the form of a number of rows. Preferably, said apertures are substantially evenly distributed over the surface of the water cooling element layer LCEL.
In the illustrated example with reference to Fig. 2c, the water cooling element layer LCEL comprises a plurality of apertures arranged in a plurality of rows. In more detail, the liquid cooling element layer LCEL comprises a first row comprising three apertures A1, A2, A3, a second row comprising four apertures B1, B2, B3, B4, a third row of four apertures C1, C2, C3, C4, C5. a fifth row comprising four apertures D1, D2, D3, D4, sixth row comprising three apertures E1, E2, E3.
Fig. 2d schematically illustrates in a plan view seen from below the part V illustrated in Fig. 2c of a device for signature adaptation according to an embodiment of the present invention.
According to an embodiment with reference to Fig. 2d, a plurality of hot plates, HP1-HP6 included in the hot plate structure HPS, exemplified with reference to Fig. 2b, are arranged to be applied to the water cooling element layer LCEL so that they overlap the apertures exemplified with reference to Fig. 2c. In more detail, said hot plates are arranged to be applied to a underside of the water cooling element layer LCEL, i.e. against a side opposite to the side of the water cooling element layer LCEL which is arranged to be applied to the first heat-conducting layer 80, exemplified with reference to Fig. 2a. Since the apertures are arranged to receive a respective temperature generating element and the heating plates are arranged to be applied to a underside of the water cooling element layer LCEL, it is possible for the hot plates to thermally contact, as well as physically contact, a underside 150: B of at least one temperature generating element.
According to an embodiment s6, a first set of hot plates, in the form of the hot plates HP1-HP5, are arranged to be applied so that each hot plate of said first set of hot plates, arranged along and overlapping a row of apertures of said plurality of rows of apertures of the liquid cooling element as said first, second, third, fourth and fifth rows exemplified with reference to Fig. 2c. Preferably, 61- each hotplate of the first set of hotplates arranged to overlap the entire surface of the respective aperture.
According to one embodiment, a transverse heating plate HP6 is arranged to be applied to the water cooling element layer LCEL so that this transverse heating plate contacts a central portion of each hot plate of said first set of hot plates HP1-HP5.
In more detail, the said transverse heating plate HP6 is arranged perpendicular to the first set of heating plates HP1-HP5. Because the transverse heating plate is arranged at right angles, the transverse heating plate enables it to contact a portion of each hot plate of the first set of hot plates. This means that heat is transported from each hot plate of the first set of hot plates to the transverse hot plate. This also means that by supplying cooling to the transverse heating plate, cooling is also supplied to all hot plates of the first set of hot plates. This makes it possible to use a structure on coolers, such as a liquid cooling plate exemplified with reference to Fig. 3a, which does not necessarily have to thank the total surface of the plurality of temperature generating elements and / or the total surface of the hot plates. It should be noted that the number of temperature generating elements and distribution of the portions thermally contact these number of temperature generating elements of the first heat conducting layer and associated configuration of the apertures (monsters) and hot plates may be configured differently from the configuration exemplified in Fig. 2a, Fig. 2b, Fig. 2c and Fig. 2d.
For example, more or fewer temperature generating elements may not enter the configuration. Furthermore, the sample according to which the apertures of the water cooling element layer are arranged can be configured differently as e.g. by more or less apertures in the monster. Furthermore, the number of hot plates and their location can be configured differently. Each of the plurality of temperature generating elements 150: 5-150: 7 may also be arranged to be applied to a plurality of intermediate thermally conductive layers, as a plurality of intermediate thermally conductive layers configured as the intermediate thermally conductive layer 160 exemplified with reference to FIG.
Id.
Fig. 3a schematically illustrates in a three-dimensional view a part VI of a device for signature adaptation according to an embodiment of the present invention.
Referring to Fig. 3a, there is shown a water cooling plate LCP arranged to be thermally applied to a hot plate, such as at least one hot plate of said plurality of hot plates exemplified by reference to the flake of Fig. 2b or Fig. 2d.
The water cooling plate LCP is arranged to transport boil thermal energy, such as heat energy arising on the inner surface 150: B of a temperature generating element, as of said at least one temperature generating element 150 exemplified with reference to any of Fig. 1a or Fig. 1 b, da this generates a predetermined temperature gradient. In more detail, the water cooling plate LCP forms part of the water cooling element layer LCEL, which in turn forms part of a water cooling element LCE, as part of said water cooling element LCE illustrated with reference to any of Figs. 32 la-c. The water cooling plate arranged to thermally contact, as physically contacting a portion of a hot plate, as at least one hot plate of said plurality of hot plates of the water cooling element layer LCEL exemplified with reference to any of Fig. 2b or Fig. 2d. Preferably, the water cooling plate is arranged to physically contact a portion of a heating plate. The water cooling plate LCP comprises a low-flow FP integrally formed in the water cooling plate, as integrally formed in a housing of the water cooling plate. The water cooling plate further comprises an inlet (not shown) to the river trough for the inflow of a water flow, such as at least one water flow example exemplified with reference to the description of Fig. 1c. The water cooling plate further comprises an outlet from the flood carriage (not shown) for outflow of a liquid river, such as at least one water flood exemplified with reference to the description of Fig. 1c.
The water cooling plate comprises a first river passage element LCPF1 arranged at the water cooling plate and configured for connection to the inlet of the river carriage and to at least one line for influencing a water flow, as said second line L2 exemplified with reference to Fig. 1c. The water cooling plate further comprises a second river passage element LCPF2 arranged at the water cooling plate and configured for connection to the outlet of the flood carriage and a line which flows out of a water river, as said third line L3 exemplified with reference to Fig. 1c.
The function of the water cooling plate is to provide the casing of the water cooling plate with a one or more components / parts, such as a heating plate, thermally applied to the water cooling plate by providing a liquid flood, including a cooling medium passing through the water cooling plate.
According to one embodiment, the Met of the said water cooling plate consists of a heat-conducting material, such as e.g. a metallic heat-conducting material in the form of aluminum. According to one embodiment, the said at least one flocculus is integrally formed in the said water cooling plate of stainless steel, such as e.g. acid-resistant stainless steel. For example, said acid-resistant stainless steel may be high-alloy austenitic stainless steel.
According to an embodiment sa, said water cooling plate is configured to enable parallel connection of a plurality of water cooling plates. According to this embodiment, the first and second river passage elements each comprise an aperture LCPA, LCPB passing through said river passage element. Said apertures LCPA, LCPB are also connected to inlets and outlets of the river bed of the water cooling plate, respectively, in order to enable transport of a water floc to and from the river bed and through the river passage elements. This means that several water cooling elements can be connected in parallel. This can be done by connecting at least one conduit, such as the said second conduit L2 exemplified with reference to Fig. 1c, to connecting means (screw, press connection or other suitable connection) of the respective first river passage elements of each of the plurality of water cooling elements so that the water flow as passing through the second conduit passes through the first river passage element of each of the plurality of water cooling elements and is channeled into the river trough of each of the plurality of water cooling elements. Similarly, at least one conduit, such as a third conduit L3 exemplified with reference to Fig. 1c, may be connected to the second flow passage element of each of the plurality of water cooling elements so that the liquid flow passing through the third conduit passes through the second flow passage element of each and one of the plurality of water cooling elements 25 and that the liquid flow passing through the river bed of each of the plurality of water cooling elements is channeled out of the water cooling elements to the third conduit.
Fig. 3b schematically illustrates in a side view the part VII of the device for signature adaptation according to an embodiment of the present invention. Referring to Fig. 3b, there is shown a water cooling plate LCP, such as a water cooling plate LCP with reference to Fig. 3a, thermally applied to a heating plate HP6, as well as at least one heating plate of said plurality of heating plates exemplified by reference to any of Figs. 2b or Figs. 2d.
According to one embodiment, the water cooling plate is arranged to thermally contact at least one hot plate of said plurality of hot plates exemplified with reference to any of Figs. 2b or 2d, such as a centrally located hot plate HP6 thermally contacting a plurality of hot plates of the first HP set. It should be noted that said water cooling plate LCP can be configured differently from the configuration described with reference to Fig. 3a and Fig. 3b. For example, the water cooling plate may comprise a plurality of tidal waves. The water cooling plate can also be constructed of other materials suitable for its purpose. The water cooling plate may further also comprise a plurality of inlets / outlets. Furthermore, a plurality of water cooling plates may also be arranged to thermally contact one or more hot plates, exemplified with reference to any of Figs. 2b or 2d.
Fig. 4 schematically illustrates in a three-dimensional view a number of surface elements arranged on a platform according to an embodiment of the present invention.
Referring to Fig. 3, there is shown a platform 800 provided with a number of said surface elements 100A, for example according to Fig. 1a, arranged exteriorly on a portion of the platform 800. Said surface elements may be arranged, according to several different configurations which differ from the configuration of the surface elements exemplified in Fig. 3. For example, more or fewer surface elements may not be present in the configuration and these surface elements may be provided on portions and / or larger portions of portions of the platform. The exemplified platform 800 is a military naval vessel, such as e.g. a surface battleship. According to this example, the platform 800 is a destroyer or a corvette. According to a preferred embodiment, the 800 vehicle is a military vehicle. The platform 800 can be a marine vessel, such as e.g. an aircraft carrier, a minesweeper, a minesweeper, a cruiser, a destroyer, a robot boat, a patrol boat, a submarine, a frigate, a battleship, a landing craft, a patrol boat, a reconnaissance boat.
According to an alternative embodiment, the platform 800 is a stationary military unit. The platform 800 is described as a vessel or a marine vessel, but it should be pointed out that the invention can also be realized and implemented in a land vessel, such as e.g. a tank. According to an alternative embodiment, the platform is an airborne vehicle such as e.g. a helicopter. According to an alternative embodiment, the platform is a civilian vehicle or unit according to any of the above mentioned types.
It should be noted that said surface element 100A with which said platform 800 is provided with a number may be configured in a number of different ways. For example, each surface element 100A of said number of surface elements may be configured according to any of the surface elements 100A-100F as exemplified by reference to any of Fig. 1a-b, Fig. 1d-e, Fig. 2a-b, Fig. 5a-b or Fig. 8a-b.
Fig. 5a schematically illustrates in an exploded perspective view the part VIII of the device for signature adaptation according to an embodiment of the present invention.
Fig. 5b schematically illustrates in an exploded side view the part VIII of the device undergoes a signature adaptation in Fig. 5a.
According to this embodiment, the device comprises a surface element 100D. The configuration of the surface element 100D with reference to Fig. 5a and Fig. 5b differs from the configuration of the surface element 100A with reference to Fig. 1a and Fig. 1b through all the surface element 100D with reference to Fig. 5a and Fig. 5b comprises a display surface 50.
The display surface 50 is arranged to emit at least one predetermined spectrum. The display surface 50 is mounted on said surface element so that the at least one predetermined spectrum is emitted in a direction directed towards a viewer. The display surface 50 is arranged to be thermally permeable, i.e. arranged to relax said predetermined temperature gradient from said temperature generating element 150 without substantially affecting said predetermined temperature gradient.
By providing a thermally permeable display surface 50 having a working temperature range within which the nominal discharge temperature gradient falls, a disengaged solution is obtained which allows to individually adjust the thermal and visual signatures independently of each other.
Fig. 6 schematically illustrates a device IX for signature matching according to an embodiment of the present invention.
The device comprises a control circuit 200 or control unit 200 arranged at a surface element 100A, such as for example a surface element 100A according to Figs. 1a-1b, the control circuit 200 being connected to the surface element 100. The surface element 100 comprises at least one temperature generating element 150 such as e.g. a temperature generating element. Said temperature generating element 150 is arranged to receive voltage / current from the control circuit 200, the temperature generating element 150 being configured in accordance with the above so that a voltage is connected, the heat from one side of the temperature generating element 150 Over * to the the other side of the temperature generating element 150.
The control circuit 200 is connected to the temperature generating element via lines 203, 204 for connecting voltage to the temperature generating element 150.
According to an embodiment in the cases where the surface element 100 comprises at least one display surface, said at least one display surface is arranged to receive voltage / current from the control circuit 200, where the display surface according to the above is configured so that all cla a voltage is connected, emitting at least one spectrum from one side of the display surface. According to this embodiment, the control circuit 200 is connected to the display surface via wires for connecting voltage to the display surface.
According to one embodiment in the cases where the surface element 100A comprises a plurality of temperature generating elements, such as a surface element 100C, comprising a plurality of temperature generating elements 150: 5-150: 7, exemplified with reference to the flake of Fig. 2a or Fig. 2b, sa is each of said plurality of temperature generating elements 150: 5-150: 7 arranged to receive voltage currents from the control circuit 200, each of said plurality of temperature generating elements 150: 5-150: 7 being arranged to receive voltage / current from the control circuit 200. , where the temperature generating elements in accordance with the above are configured so that when a voltage is connected, the heat from one side of the respective temperature generating element 150: 5-150: 7 Over * to the other side of the respective temperature generating element 150: 5-150: 7.
According to an embodiment in the cases where the surface element 100A comprises a plurality of temperature generating elements 150: 5-150: 7, the control circuit 200 may be arranged to regulate current / voltage to the temperature generating elements individually.
According to one embodiment in the cases where the surface element 100A comprises a plurality of temperature generating elements, such as a plurality of temperature generating elements 150: 5-150: 7 exemplified with reference to any of Fig. 2a or Fig. 2b, then the surface element comprises a plurality of control circuits, each and an arranged all regulating voltage / current to a temperature generating element of said plurality of temperature generating elements. According to one embodiment, the device comprises at least one temperature sensing means 210, dashed in Fig. 2, arranged to sense the actual physical temperature of the surface element 100A. The temperature is according to a variant arranged to be compared with temperature information, preferably continuous information, from the thermal sensing means of the control circuit 38 200. In this case the temperature sensing means is connected to the control circuit 200 via a line 205. The control circuit is arranged to receive a signal via the line temperature data. arranged all comparing temperature data with temperature data from the thermal sensing means.
The at least one temperature sensing means 210 is according to an embodiment arranged on or adjacent to the outer surface of the temperature generating element 150 so that the temperature sensed is the surface temperature of the surface element 100A. The at least one temperature sensing means 210 is according to an embodiment arranged on or adjacent to the inner and / or outer surface of the surface element 100 so that all the temperature sensed is the surface temperature of the surface element 100.
Since it by means of the at least one temperature sensing means 2 senses the temperature when compared with temperature information of the thermal sensing means of the control circuit 200 differs from the temperature information of the thermal sensing means of the control circuit 200, the voltage to the temperature generating element 150 is according to one embodiment arranged and controlled. agrees, wherein the surface temperature of the surface element 100A by the temperature generating element 150 is adjusted accordingly.
The design of the control circuit 200 depends on the application. According to a variant, the control circuit 200 comprises a switch, in which case voltage across the temperature-generating element 150 is arranged to be switched on or off to provide cooling (or heating) of the surface of the surface element. Fig. 10 shows the control circuit according to an embodiment of the invention where the device according to the invention is intended to be used Mr signature adaptation, related to thermal, radar and visual camouflage of, for example, a vehicle. It should be noted that the surface element 100A may be configured differently from the configuration illustrated with reference to Fig. 6. For example, the surface element 100A may comprise more or less components and / or be configured in accordance with any of the surface elements 100A-100F as exemplified with reference to any of Fig. 1a-b, Fig. 1d-e, Fig. 2a-b, Fig. 5a-b or Fig. 8a-b.
Fig. 7a schematically illustrates in a side view a display surface according to an embodiment of the present invention.
According to one embodiment, the display surface 50, as the display surface 50 is exemplified with reference to the flag of Fig. 5a or Fig. 5b, is of the emitting type. Emitting type display surface refers to a display surface that actively generates and emits light LE. Examples of display elements of the emitting type are e.g. a display surface utilizing the flag of the following techniques: LCD ("Liquid Crystal Display"), LED ("Light Emitting Diode"), OLED ("Organic Light emitting Diode") or other light emitting technology based on either organic or non-organic electrochromic technology or equivalent.
Fig. 7b schematically illustrates in a side view a display surface according to an embodiment of the present invention.
According to a preferred embodiment, the display surface 50 as the display surface is exemplified with reference to the flag of Fig. 5a or Fig. 5b, of the reflective type. By reflective type display surface is meant a display surface arranged to receive incident light LI and emit reflected light LR by using said incident light LI. Examples of display elements of a reflective type are e.g. display surfaces utilizing any of the following display techniques: electrically controllable organic electrochromes (Ed, Electrically Controllable Organic Electrochromes), electrically controllable inorganic electrochromes (ECO), or other suitable reflective technology such as "E-ink", electrophoretic, cholesteric, microelectromechanical system (MEMS) coupled to one or more optical films or electrofluidic. By using a display surface 50 of a reflective type, it is possible to reproduce at least one spectrum which faithfully reproduces structures / colors, since this type uses naturally incident light instead of generating its own light, which e.g. an emitted type display surface such as an LCD Common to a reflective type display surface is that a applied voltage allows modification of the reflection properties of the usual individual pixel P1-P4. Thus, by regulating applied voltage to the usual pixel, each pixel allows Merge a certain color upon reflection of incident light which is dependent on the voltage applied.
According to an alternative embodiment, the display surface 50 is of reflective type and emitting type such as multimodal liquid crystal (Multimode LCD). Where said display surface 50 according to this embodiment is arranged to both emit at least one spectrum and to reflect at least one spectrum.
Fig. 7c schematically illustrates in a view above the display surface according to an embodiment of the present invention.
The display surface 50, like the display surface 50 exemplified by reference to the flag of Fig. 5a or Fig. 5b, comprises a plurality of pixels ("pixels") P1-P4, wherein said pixels P1-P4 each comprise a plurality of sub-elements ("sub-pixels"). S1-S4. Named pixels P1-P4 have a spread in height H and a spread in width W.
According to one embodiment, the pixels each have a spread in height H in the range 0.01-100 mm, for example 5-30 mm. According to one embodiment, the pixels each have a spread in width W in the range 0.01 mm - 100 mm, for example 5-30 mm.
According to one embodiment, the conventional pixel P1-P4 comprises at least three sub-elements S1-S4. Where each of the three sub-elements of the narrative is arranged 41 to emit a color of the primary colors red, green or blue (RGB) or the secondary colors cyan, magenta, yellow or black (CMYK). By regulating the light intensity emitted from the respective sub-elements by means of control signals, it is possible for the habitual pixel to emit which color / spectrum is raised, for example white or black.
According to one embodiment, the conventional pixel P1-P4 comprises at least four sub-elements S1-S4. Where each of three of said four sub-elements is arranged to emit a color of the primary colors red, green or blue (RGB) or the secondary colors cyan, magenta, yellow, or black (CMYK) and where one of said four sub-elements is arranged to emit one or more spectra which comprise components which fall outside the visual wavelengths such as e.g. arranged to emit one or more spectra comprising components within the infrared wavelengths. By emitting one or more spectra comprising components falling within the infrared range and one or more components falling within the visual range, it is possible to regulate the thermal signature in addition to the visual signature by means of the components falling within the infrared range. This makes it possible to shorten the response time which is connected to adapting the thermal signature by means of the said thermoelectric element 150.
Said display surface can be arranged according to several different configurations which differ compared with the configuration of the display surface exemplified in Fig. 7c. For example, multiple or fame pixels may not be in the configuration and these pixels may include multiple or farm subelements.
The display surface 50 is formed according to an embodiment of thin film, for example thin film 25 essentially of polymeric material. Said thin film may comprise one or more active and / or passive layers / thin layers as well as one or more components such as electrically responsive components / layers or passive / active filters.
The display surface 50 is formed according to an embodiment of flexible thin film. According to one embodiment, the display surface 50 has a thickness in the range 0.01-5 mm, for example 0.1-0.5 mm, where dimensioning depends, among other things, on application and desired efficiency.
The pixels P1-P4 of the display surface 50 have, according to one embodiment, a width in the range 1-5 mm, for example 0.5-1.5 mm and a height in the range 1-5 mm, for example 0.5-1.5 mm, where dimensioning depends on application and desired efficiency.
According to one embodiment, the display surface 50 has a thickness in the range 0.05-15 mm, for example 0.1-0.5 mm, according to a variant around 0.3 mm, where the thickness 10 depends, among other things, on application and desired thermal permeability, color rendering and efficiency.
According to an embodiment, the display surface 50 is configured to have a working temperature range which comprises the temperature range within which the desired thermal adjustment takes place, for example morning -20-150 ° C. At least one reproduction of said at least one predetermined spectrum for desired visual adaptation is not substantially affected by the desired temperature for thermal signature adaptation from the underlying layer.
According to one embodiment, the display surface 50 is of the emitting type and provided with all the provided direction-dependent reflection. For example, each pixel 20 of the display surface 50 may be arranged to alternately provide at least two different spectra. This can be accomplished by all provided at least two independent control signals so that habit pixel Merger At least two different spectra at at least two different times defined by one or more refresh rates. Fig. 7d schematically illustrates in a side view a display surface according to an embodiment of the present invention.
According to one embodiment, the display surface 50, as the display surface 50 is exemplified with reference to any of Fig. 5a or Fig. 5b, is of the reflective type and arranged 43 to provide direction-dependent reflection. According to this embodiment, the display surface comprises at least a first underlying display layer 51 and a second overlying display layer 52. The first display layer 51 is arranged as a reflective layer comprising at least one curved reflective surface 53. According to this embodiment, the profile of said at least one curved reflective surface shaped like a number of trapezoids. Said second display layer 52 is arranged as an obstructing layer comprising at least one optical filter structure 55, 56, wherein said at least one filter structure 55, 56 is arranged to obstruct incident light of selected angles of incidence and armed to prevent reflection from the first display layer 51. Said curved reflective surface 53 includes a plurality of sub-surfaces 51A-F, each arranged to reflect incident light within a predetermined angular range or at a predetermined angle. According to this embodiment, the curved reflective surface 53 comprises a first sub-surface 51B and a second sub-surface 51E arranged substantially parallel to the plane corresponding to the display surface. Said first and second sub-surfaces are arranged to reflect light incident incident orthogonally towards the display surface 50. The curved reflective surface 53 further comprises a third sub-surface 51A, a fourth sub-surface 51C, a fifth sub-surface 51D and a sixth sub-surface 51F. Said fourth and sixth sub-surfaces 51C, 51F are arranged to reflect light incident within a predetermined angular range which is offset at a first predetermined angle relativt1 relative to the orthogonal axis. Said third and fifth sub-surfaces 51A, 51D are arranged to reflect light incident within a predetermined angular range which is offset at a second predetermined angle relativt2 relative to the orthogonal axis, said first predetermined angle 25 being on the opposite side of the orthogonal axis relative to said second Angle.
According to one embodiment, the obstructing layer comprises at least one first filter structure 55. Where the at least one first filter structure 55 is arranged as a triangle with an extension along a vertical direction of the display surface, i.e. designed as a triangular prism. According to one embodiment, the obstructing layer comprises at least a second filter structure 56, wherein said at least one second filter structure 56 is arranged as a plurality of pins / rods extending along an orthogonal direction of the display surface, the length of the at least one second filter structure 56 being configured not preventing light incident within said a predetermined angular range offset at a first predetermined angle relative to the orthogonal axis and light incident within said a predetermined angular range offset at a second predetermined angle relative to the orthogonal axis. This makes it possible to limit the angular range within which reflection of light incident substantially orthogonally to the display surface takes place.
Fig. 7e schematically illustrates in a plan view parts of the display surface according to an embodiment of the present invention.
According to one embodiment, said curved reflective surface 53 is arranged to form a three-dimensional sample, wherein said three-dimensional sample comprises a number of columns and a number of rows of truncated pyramids, i.e. a matrix of pyramids in which an upper structure of the pyramids is cut off in a plane parallel to the bottom surface of the pyramid. According to this embodiment, the at least one first filter structure 55 of the obstructing layer 52 is formed as a central pyramid surrounded by truncated pyramids, the tapered directions of propagation of which are opposite to those of the truncated pyramids of the reflecting layer. A center point has the obstructing layer defined by the position of the top of the centrally located pyramid with associated truncated pyramids arranged along the sides of the centrally located pyramid is arranged to be centered. The intersection point formed between the rows and columns of truncated pyramids has the reflective layer 53. , as illustrated by the dashed arrow in Figure 7e. By arranging the curved reflecting surface 53 and the filter structures 55 according to the above, gaps are formed free from obstruction 30 which are orthogonal to the respective partial surface, said curved reflecting surface having directional reflection is possible where reflection of the incident light falling within said gaps is possible. According to this embodiment, each sub-surface 51G-51K formed by the front surfaces of the truncated pyramids of the curved reflective layer is arranged to provide at least one pixel each. This enables individually adapted reflection of incident light that falls into four different angles of incidence or four different ranges of angles of incidence.
By providing a direction-dependent display surface 50 according to Figures 7d-e, it is possible for Merge to have at least one spectrum such as one or more patterns 10 and colors at different viewing angles relative to an orthogonal axis of the display surface. This also makes it possible to emit different monsters and colors in different viewing angles.
Configuration of the display surface 50 may differ from the configuration described in Figs. 7d-e. Placement and design of filter structures in said obstructing layers can, for example, be configured differently. The number of filter structures can also differ. Said first display layer 51 may be arranged as an emitting layer. The display surface 50 may comprise more or less layers. Furthermore, interference phenomena together with one or more reflection layers, optical deceleration layers and one or more circularly polarized layers or one or more linearly polarized layers in combination with one or more quarter-way retardation layers can be used to provide direction-dependent reflection.
According to one embodiment, the display surface 50 comprises at least one barrier layer, wherein the at least one barrier layer is arranged to be thermally and visually permeable and substantially impermeable to moisture and liquid. By coating the display surface with at least one barrier layer, robustness and durability are improved in terms of external environmental impact.
Fig. 8a schematically illustrates in an exploded side view a part X of the device for signature adaptation according to an embodiment of the present invention. 46 Referring to Fig. 8a, a surface member 100E is shown. The surface element 100E comprises a temperature generating element 150 arranged to generate at least one predetermined temperature gradient. The at least one temperature generating element 150 is arranged to generate said predetermined temperature gradient to a portion of a first heat conducting layer 80 of said surface element 100E. The surface element 100E further comprises an intermediate thermally conductive element 160, such as an intermediate thermally conductive element exemplified with reference to Fig. 1d. The surface element 100E further comprises a water cooling element LCE, such as a water cooling element 10 comprising a water cooling element layer LCEL, a hot plate structure HPS and a cooling plate LCP, for example according to Fig. 1d. The surface element 100E further comprises an underlying radar suppressing element 190 arranged to absorb incident radio waves and consequently to vapor reflect reflection of incident radio waves as radio waves generated from a radar system. Said radar suppressing element 190 is constituted by one or more layers, each comprising one or more radar absorbing material or surface layer (RAM), for example as described in connection with Figure 8c. The surface element 100E further comprises an intermediate insulating layer 131 arranged between the first heat conducting layer 80 and the radar suppressing element 190.
The intermediate insulating layer 131 is arranged to provide an insulation so that heat generated in the radar suppressing element does not spread to the first heat conducting layer 80. The intermediate insulating layer 131, the radar suppressing element 190 and the water cooling element layer are arranged with an aperture arranged to 25 element 150.
According to one embodiment, said first intermediate insulating layer 131 is made of a material which enables transmission of incident radio waves from a radar system.
According to one embodiment, the first heat-conducting layer 80 of said surface element 100E is arranged to be thermally conductive and frequency-selective, 47 for example according to Figures 8c-d. According to this embodiment, said first heat conducting layer 80 is arranged to be all frequency selective so that incident radio waves are filtered out and passed through the heat conducting layer 80. This means that filtered incident radio waves are absorbed by said underlying radar suppressing element 190. According to this embodiment, said temperature is at least element 150 applied to a first partial surface 81 on the underside of the first thermally conductive layer 80. According to this embodiment, the first thermal conductive layer 80 is arranged to provide an outer frequency selective partial surface 82 which substantially surrounds said first partial surface 81. By providing an attack surface against which said at least one temperature generating element 150 abutting which is free from frequency selective sub-surface enables a more efficient and faster heat conduction of the first heat conducting layer 80.
Fig. 8b schematically illustrates in an exploded side view a part XI of the device for signature adaptation according to an embodiment of the present invention.
Referring to Fig. 8b, a surface member 100F is shown. The surface element 100F differs from the configuration of the surface element 100E, exemplified with reference to Fig. 8a, in that the surface element 100F comprises a reinforcing layer 180. The reinforcing layer 180 is arranged to protect structures of the surface element 20 below the reinforcing layer 180 against direct action fire, explosion and / or splits. By providing a reinforcing layer of surface elements, modular armor of objects loaded with a plurality of surface elements is possible, where individual forged surface elements can be easily replaced. In more detail, the reinforcing layer 180 is disposed between the radar absorbing layer 190 and the water cooling element layer LCEL. The reinforcing layer 180 is also provided with a recess, such as a continuous aperture which receives the intermediate heat-conducting layer 160.
The reinforcing layer 180 is according to an embodiment formed of alumina such as e.g. of AL203 or similar materials with good properties in terms of ballistic protection. According to one embodiment, the reinforcing layer 180 has a thickness in the range 4-30 mm, for example 8-20 mm, where the thickness depends, among other things, on the application and the desired efficiency.
According to an embodiment of the device according to the invention, the heat-conducting element 160 is formed of a material with good properties of bile heat conduction and ballistic protection such as e.g. silicon carbide SiC.
According to one embodiment, at least some of said heat conducting elements 160 and the reinforcing layer 180 are formed of nanomaterials.
The reinforcing layer 180 and / or the intermediate heat conducting element 160 may be provided to provide ballistic protection 6 at least according to the protection class defined by NATO standard, 7.62 AP WC ("STANAG Level 3").
According to an embodiment of the device according to the invention, the surface element also comprises at least one electromagnetic protection structure (not shown) arranged to protect against electromagnetic pulses (EMP), which can be generated by weapon systems intended to knock out electronic systems. Named at least one electromagnetic protection structure can e.g. is formed by a thin layer that absorbs / reflects electromagnetic straining, such as a thin layer of aluminum foil or other suitable material.
According to an alternative embodiment, one or more substructures are arranged to provide a Faraday cage which encapsulates at least the control circuit.
According to an alternative embodiment, the surface element is arranged to provide a Faraday cage and at least one thin layer is arranged to absorb / reflect electromagnetic radiation. It should be noted that some of the surface elements 100E and 100F may be configured differently from the configuration exemplified in Fig. 8a and Fig. 8b. For example, some of the surface elements 100E and 100F may include a display surface 50, as exemplified with reference to the flaps of Fig. 5a and Fig. 5b. Further 49, some of the surface elements 100E and 100F may comprise a plurality of temperature generating elements 150: 5-150: 7 as exemplified with reference to Fig. 2a and Fig. 2b. Furthermore, some of the surface elements 100E and 100F may comprise a hot plate structure HPS configured as exemplified with reference to Fig. 2c and Fig. 2d. Furthermore, some of the surface elements 100E and 100F may comprise a housing element 510, such as a housing element 510, exemplified with reference to Fig. 1d. In cases where some of the surface elements 100E or 100F comprise an enclosure housing 510, this enclosure housing is provided with frequency selective functionality. Furthermore, the surface element 100F can be configured without including radar absorbing functionality.
Fig. 8c schematically illustrates in a plan view a structure of the signature matching device according to an embodiment of the present invention.
Referring to Fig. 8c, a frequency selective surface FSS arranged in at least one element / layer of the device is shown. According to this embodiment, the frequency-selective surface FSS, for example according to Figure 8a, is integrated in the first heat-conducting layer or in the first heat-conducting layer 80 and the enclosure housing 510.
The frequency-selective surface FSS can e.g. provided by forming a plurality of resonant slit elements such as "patches" arranged on the housing and the first thermally conductive layer 80 or arranged as continuous structures STR passing through the housing 510 and the first thermally conductive layer 80, each of the continuous structures STR .ex. are shaped like crossed dipoles. Said resonant slit elements are formed in a suitable geometric sample, for example in a periodic metallic pattern so that suitable electrical properties are obtained.
By configuring the shape of the respective plurality of resonant elements and the geometric sample formed by the plurality of resonant elements, it is possible for incident radar systems (RF, "radiofrequencies") generated radar systems to be filtered / transmitted through said frequency selective surface. For example, the frequency selective surface may be arranged to relax radio waves of one or more frequencies, wherein said one or more frequencies are related to frequency ranges, typically associated with radar systems such as radar waves of a frequency in the range 0.1-100 GHz, for example 10-30 GHz.
According to this embodiment, said plurality of resonant elements formed as continuous structures are arranged peripherally from the center of said first heat conducting element 80 and the housing 510 so that they do not overlap underlying temperature generating elements 150, thereby heat conducting from underlying temperature generating elements 150 to upper surface elements of the upper element. not affected.
According to this embodiment, the device comprises a radar suppressing element 190 which is also referred to as a radar absorbing element 190. Said radar absorbing element 190 is arranged to absorb incident radio waves generated from radar systems.
According to one embodiment, said plurality of resonant slit elements are formed according to any of the following alternatives squared, rectangular, circular, Jerusalem cross, dipoles, wires, crossed wires, bipartite strips or other suitable frequency selective structure. According to one embodiment, said frequency selective surface FSS is arranged to be combined with at least one layer consisting of electrically controllable conductive polymers, wherein the frequency range or the frequency which the frequency selective surface is arranged to relax through can be regulated by applying a voltage to said 6 at least one layers of said electrically controllable conductive polymers.
According to an alternative embodiment, for example, one or more microelectromechanical system structures (M EMS) may be integrated in said frequency selective surface and wherein said one or more MEMS structures are arranged to regulate the permeability of said frequency selective surface for radio waves within different frequency ranges.
According to one embodiment, the radar absorbing element 190 has a thickness in the range 0.1-15 mm, for example 0.5-1.5 mm, where the thickness depends, among other things, on application and the desired efficiency.
According to one embodiment, said radar absorbing element is formed of a layer covered by a paint layer comprising iron balls ("Iron ball paint"), comprising small spheres covered with carbonyl iron or ferrite. Alternatively, said layer of paint comprises both ferrofluidic and non-magnetic substances.
According to one embodiment, said radar absorbing element is formed of a material comprising neoprene polymer layers with ferrite granules or carbon black particles comprising a percentage of crystalline graphite embedded in the polymer matrix formed by said polymer layer. The percentage of crystalline graphite can e.g. be in the range of 20-40% sasorn e.g. 30%.
According to one embodiment, said radar absorbing element is formed of a foam material. For example, said foam material can be formed of urethane foam with "carbon black". According to one embodiment, said radar absorbing element is formed of a nanomaterial.
Fig. 8d schematically illustrates in a plan view the temperature flow in a structure of the signature matching device according to an embodiment of the present invention.
Referring to Fig. 8d, a frequency selective surface FSS arranged in at least one element / layer of the device is shown. According to this embodiment, for example, according to Figure 8a, the frequency selective surface FSS is integrated in the outer layer 80 or in the enclosure housing 510 and the first thermally conductive layer 80. According to this embodiment, the resonant elements are formed in a geometric metallic sample surrounding the engagement surface 81 against which said at least one thermoelectric element 150 is arranged so that a plurality of gaps released from said plurality of resonant elements are formed. Said plurality of slots are arranged to run in substantially straight lines in the plane of the first heat-conducting element and the first encapsulation element, said plurality of slots being extending from a center point of said attack surface. This enables efficient transport of heat along said plurality of slits out to the peripheral portions of said first heat conductive layer 80 and the enclosure housing 510, where heat transport is illustrated by arrows E.
Fig. 9 schematically illustrates a plan view of a module element 500 according to an embodiment of the present invention.
According to this embodiment, the module element 500 is hexagonally designed. This enables simple and general adaptation and assembly when assembling modular systems, for example according to Figs. 11a-c. Furthermore, an even temperature can be generated on the entire hexagonal surface, whereby local temperature differences which may arise in horns of, for example, a square-shaped module element are avoided.
The module element 500 comprises a control circuit 200 connected to the thermoelectric element 150, the thermoelectric element 150 being arranged to generate a predetermined temperature gradient to a portion of the first thermally conductive layer 80 of the module element 500, for example according to Fig. 6, where the predetermined temperature gradient is provided by means of voltage applied from the control circuit to the thermoelectric element 150 where the voltage is based on temperature data or temperature information from the control circuit 200. The module element 500 comprises an interface 570 for electrically connecting module elements for assembly to a module system. According to one embodiment, the interface comprises a connector 570.
The module element can be dimensioned as small as an area of about 5 cm2, where the size of the module element is limited by the control circuit.
The surface of the module element 500 is according to an embodiment in the range 25-8000 cm 2, for example 75-1000 cm 2. According to an embodiment, the thickness of the surface element is in the range 5-60 mm, for example 10-20 mm, where the thickness depends, among other things, on application and desired thermal conductivity and efficiency, as well as the material of the various layers / elements.
The module element 500 and its layers have been described above as flat. Other alternative designs / configurations are also conceivable. Furthermore, other configurations than those described are gallant relative placement of the elements / layers of module elements conceivable. Furthermore, other configurations than those described are gallant number of elements / layers and their respective function is conceivable.
The module element 500 further comprises a temperature sensing means 210, which according to one embodiment is constituted by a thermal sensor. The temperature sensing means 210 is arranged to sens all the current temperature. According to a variant, the temperature sensing means 210 is arranged to supply a voltage drop through a material which is arranged furthest out on the sensor, which material has such properties that it changes resistance depending on temperature. According to one embodiment, the thermosensor comprises two types of metals which in its spruce layer generate a weak voltage depending on temperature. This voltage arises from the Seebeck effect. The magnitude of the voltage is directly proportional to the magnitude of this temperature gradient. Depending on the temperature range you want to feed, different types of sensors light up better than others, where different types of metals that generate different voltages can be used. The temperature is then arranged 54 to be compared with continuous information from a thermal sensing means arranged to scan / copy the thermal background, i.e. the background temperature. The temperature sensing means 210, for example one or more thermosensors, is fixed on the top of the first heat conducting layer 80, and the temperature sensing means in the form of, for example, one or more thermosensors 80 can be made very thin and can according to one embodiment be arranged in the first heat conducting layer. for example the graphite layer, in which a recess for countersinking the sensor 80 according to an embodiment is arranged.
According to one embodiment, the thermoelectric element 150 is arranged in a water cooling element layer LCEL which forms part of a water cooling element, as exemplified in Fig. 1d. The temperature sensing means 210 is according to an embodiment arranged in layer 110 and in close connection with the outer surface of the thermoelectric element 150. A voltage is connected to the thermoelectric element 150, the thermoelectric element 150 being configured so as to connect a voltage. the heat ft-6n one side of the thermoelectric element 150 Over * to the other side of the thermoelectric element 150. Since it by the sensing means 210 senses the temperature in comparison with temperature information from the thermal sensing means differs from that the temperature information is the voltage to the thermoelectric the element 150 is arranged to be controlled so that and the borehole coincide, the temperature of the module element 500 by means of the thermoelectric element 150 being adjusted accordingly. It should be noted that the module element 500 may be configured differently from the module element 500 illustrated in Fig. 9. For example, the module element may comprise a display surface 50, as exemplified with reference to Fig. 5a. Furthermore, the module element may comprise more components as illustrated with reference to the flaps of Figs. 1a-b, Figs. 1d-e, Figs. 2a-b, Figs. 5a-b or Figs. 8a-d. Fig. 10 schematically illustrates a device XII for signature matching according to an embodiment of the present invention.
The device comprises a control circuit 200 or control unit 200 and a surface element 100A-F, for example a surface element 100A according to Fig. 1a, the control circuit being connected to the surface element 100A. The device comprises a thermoelectric element 150. Said thermoelectric element 150 is arranged to receive voltage from the control circuit 200 where the thermoelectric element 150 in accordance with the above is configured so that when a voltage is connected, the heat from one side of the thermoelectric element 150 Over * to the other side of the thermoelectric element.
The device includes the embodied temperature sensing means 210 arranged to sense the actual temperature of the surface element 500. The temperature sensing means 210 is according to an embodiment as shown in Fig. 6 arranged on or adjacent to the outer surface of the thermoelectric element 150 so that the temperature sensed to the surface element 100 is .
The control circuit 200 comprises a thermal sensing means 610 arranged to sense temperature as well as background temperature. The control circuit 200 further comprises a software unit 620 arranged to receive and process temperature data from the thermal sensing means 610. The thermal sensing means 610 is consequently connected to the software unit 620 via a line 602, the software unit 620 being arranged to receive a signal representing background temperature.
In the case where the module element 500 comprises at least one display surface 50 so-called at least one display surface 50 arranged to receive voltage / current from the control circuit 200, the display surface 50 being configured in accordance with the above so that when a voltage is connected, emitting at least one spectrum from one side of the display surface 50. In this case, the control circuit 200 also comprises a visual scanning means 615 arranged to sense 56 visual structure as one or more visual structures describing objects in an environment of the device. Said software unit 620 5r comprises all receiving and processing visual structure data from the visual scanning means 615, for example arranged arranged to receive and process visual structure data 5 comprising one or more images / image sequences. Accordingly, the visual scanning means 615 is connected to the software unit 620 via a line 599, the software unit 620 being arranged to receive a signal representing background temperature data.
The software unit 620 is further arranged to receive instructions from a user interface 630 with which it is arranged to communicate. The software unit 620 is connected to the user interface 630 via line 603. The software unit 620 is arranged to receive via the line 603 a signal from the user interface 630 representing instruction data, i.e. information on how the software unit 620 is to software process temperature data from the thermal sensing means 610 and visual structure data from the visual sensing means 615. The user interface 630 can for example when the device is arranged on military vehicles and intended for thermal or thermal and visual camouflage and / or thermal camouflage and / or a visual sample of said vehicle is configured so that any operator, based on the rated threat direction, can choose to focus available power in the device and get all the best possible signatures against the background. This is illustrated in more detail in connection with Fig. 14.
According to this embodiment, the control circuit 200 further comprises an analog / digital converter 640 connected via a line 604 to the software unit 620. The software unit 620 is arranged to receive via the line 604 a signal representing information packets from the software unit 620 and arranged to convert information packets, i.e. from the user interface 630 communicated information and processed temperature data. The user interface 630 is arranged to determine, based on the or which direction of threat is selected, which camera / video camera / IR camera / sensor is to supply information to the software unit 620. According to one embodiment, in this analog / digital converter 640 all this analog information is converted to binds digital information via standard A / D converters 5 which are small integrated circuits. As a result, no cables are required. According to an embodiment described in connection with Figs. 11a-c, the digital information is arranged to be superimposed on a power supply framework of the vehicle.
The control circuit 200 further comprises a digital information receiver 6 connected to the digital / analog converter 640 via a link 605. From the software unit 620 information is sent analogously to the digital / analog converter 640 where information about which temperature (selected) surface elements must have been registered. All this is digitized in the digital / analog converter 640 and is sent according to standard design as a digital sequence containing unique digital identities for custom module elements 500 with associated information about drilling value etc. This sequence is read by the digital information receiver 650 and only the identity corresponding to what is pre-programmed in the digital information receiver 650 is read. In the usual module element 500, a digital information receiver 650 with a unique identity is arranged. When the digital information receiver 650 detects that there is a digital sequence with a true digital identity, it is arranged to register the associated information and the remaining digital information is not registered. This process takes place in the usual digital information receiver 650 and unique information to the usual module elements 500 is obtained. This technology is referred to as CAN technology.
The control circuit 200 further comprises a temperature control circuit 600 connected via a line 605 to the analog-to-digital converter 640. The temperature control circuit 600 is arranged to receive via the line 605 a digital signal in the form of digital tags representing temperature data. The temperature sensing means 210 is connected to the temperature control circuit via a feedback link 205, the temperature control circuit 600 being arranged to receive via the 205 a signal representing temperature data sensed by the temperature sensing means 210. The temperature control circuit 600 is connected to the thermoelectric element 20 to the thermoelectric element 150. The temperature control circuit 600 is arranged to compare temperature data from the temperature sensing means 210 with temperature data from the thermal sensing means 610, the temperature control circuit 600 being arranged to send a current to / apply a voltage across the thermoelectric element 150 corresponding to the difference. the temperature of the surface of the module element 500 is adapted to the background temperature. The temperature sensing by means of the temperature sensing means 210 is consequently arranged to be compared with continuous temperature information from the thermal sensing means 610 of the control circuit 200.
According to this embodiment, the temperature control circuit 600 comprises the digital information receiver 650, a PID circuit 20660 connected to the digital information receiver 650 via a link 606, and a controller 670 connected via a link 607 to the PID circuit. In line 606, a signal representing specific digital information so that habit surface elements 500 can be controlled so that bar and inheritance values are matched is arranged to be sent.
The controller 670 is then connected to the thermoelectric element 1 via the lines 203, 204. The temperature sensing means 210 is connected to the PID circuit 660 via the line 205, the PID circuit being arranged to receive via the line 205 the signal representing temperature data sensing by means of the temperature sensing 210. 670 is arranged to receive via the line 607 a signal from the PID circuit 660 representing 59 information may all aka or reduce current supply / voltage to the thermoelectric element 150.
In the case where the module element 500 comprises at least one display surface 50 sa, the control circuit 200 further comprises a digital information receiver 5 655 connected to the digital / analog converter 640 via a link 598. From the software unit 620 information analog is sent to the digital / analog converter 640 where information about which visual structure each surface element must have been registered. All of this is digitized in the digital / analog converter 640 and sent according to standard performance as a digital sequence containing 10 unique digital identities for each module element 500. This sequence is read by the digital information receiver 655 and only the identity corresponding to what is pre-programmed in it the digital information receiver 655 is read. In each module element 500, a digital information receiver 655 with a unique identity is arranged. When the digital information receiver 655 detects that there is a digital sequence with a digital identity, it is arranged to register the associated information and the remaining digital information is not registered. This process takes place in each digital information receiver 655 and unique information for each module element 500 is obtained. This technology is referred to as CAN technology. In these cases, the control circuit 200 further comprises an image control circuit 601 connected via a link 598 to the analog-to-digital converter 640. The image control circuit 601 is arranged to receive via the line 598 a digital signal in the form of digital tags representing visual structure data as well as data representing one or more images. / image sequences.
The image control circuit 601 is connected to the display surface 50 via wires 221, 222 for connecting voltage to the display surface 50. The image control circuit 601 is arranged to receive visual structure data from said visual sensing means and store said visual structure data in at least one memory buffer, the image control circuit reading said memory buffer at a predetermined time interval and sending at least one signal / current to / applying at least one voltage across the display surface 50 corresponding to the desired light intensity / reflection property of each of the sub-elements S1-S4 of habit pixel P1-P4 so as to output at least a spectrum of the surface of the surface element 500 is adapted to the visual background structure described by the said visual structure data.
The image control circuit 601 according to this embodiment comprises the digital information receiver 655, an image control unit 665 connected to the digital information receiver 655 via a link 625, and an image controller 675 connected via a link 626 to the image control unit 665. The image control unit 66 comprises at least one data processing means and at least one data processing unit. The image controller 665 is arranged to receive data from the digital information receiver 655 and store this data in a memory buffer of said memory unit. The image control unit is further arranged to process data stored in said memory buffer, for example by applying a look-up table (LUT, Look-Up-Table) or other suitable algorithm which maps data stored in the memory buffer to individual pixels P1- at a far-fixed frequency or at a predetermined time interval. P4 and / or sub-elements S1-S4 of the display surface 50 of the surface element 500. In line 625, a signal representing specific digital information for all the display surface 50 of surface elements 500 must be controllable so as to output at least one spectrum from the display surface 50 and recorded data from the digital information receiver stems Overen arranged to be sent. In line 626, a signal representing specific digital information so that the respective pixel P1-P4 and / or sub-elements S1-S4 of the display surface 50 of surface elements 500 can be controlled so as to output at least one spectrum of the display surface 50 and recorded data from the digital information receiver. stems arranged to be sent.
The image controller 675 is then connected to the display surface 50 via the lanes 221, 222. The image controller 675 is arranged to receive via the lane 626 a signal 30 from the image control unit 655 representing information to increase or decrease 61 current supply / voltage to the respective car points P1-P4 and / or subelements. S1-S4 of the display surface 50. The image controller 675 is further arranged to send one or more signals to the display surface 50 via the lanes 221, 222 depending on the received signal from. n the image control unit 655. The one or more signals arranged to be sent to the display surface 50 from the image controller may comprise one or more falling signals: pulse modulated signals, pulse amplitude modulated signals, pulse width modulated signals, pulse code modulated signals, pulse modulus, pulse shift, named one or more signals.
The thermoelectric element 150 is configured so that when the voltage is connected, the heat from one side of the thermoelectric element 150 transfers to the other side of the thermoelectric element 150. Then, by means of the temperature sensing means 210, it senses the temperature in comparison with temperature information from the thermal the sensing means 150 differs from the temperature information from the thermal sensing means, the voltage to the thermoelectric element 150 is arranged to be regulated so that the actual and bore values are matched, the temperature of the surface of the module element 500 being adjusted accordingly by the thermoelectric element according to the armed.
According to one embodiment, the thermal sensing means 150 comprises at least one temperature sensor such as a thermal sensor arranged to supply the ambient temperature. According to another embodiment, the thermal sensing means 150 comprises at least one IR sensor arranged to supply the apparent temperature of the background, i.e. arranged to feed an average of the background temperature. According to yet another embodiment, the thermal sensing means 150 comprises at least one IR camera arranged to read the thermal structure of the background. These different variants of thermal sensing means are described in more detail in connection with Figs. 11a-c. According to one embodiment, said temperature control circuit 600 is arranged to send temperature information about and / or the value to the software unit 620. According to this embodiment, the narrinda software unit 620 is arranged to process received drilling and / or inheritances 5 together with characteristic descriptive response times for temperature control. provide temperature compensation information. There, said temperature compensation information is sent to the image control circuit 601 which is arranged based on said temperature compensation information to provide information causing the at least one display surface 50 to emit at least one vagal component falling within the infrared spectrum in addition to providing at least one spectrum corresponding to the background background. This enables all to improve the response time to achieve thermal adaptation. According to one embodiment, the control circuit 200 comprises a distance detecting means (not shown) such as a laser range feeder ("Laser Range Finder") arranged to input distance and angle to one or more objects in the vicinity of the device. The software unit 620 is arranged to receive and process the distance data and the angular data from the distance detecting means. The distance detecting means is consequently connected to the software unit 620 via a link (not shown), the software unit 620 being arranged to receive a signal representing the distance data and the angular data. The software unit 620 is provided with all the processed temperature data and visual structure data by relating temperature data and visual structure data to distance data and angle data as well as relating distance and angle to objects in the background. Said software unit 620 is further arranged to apply at least one transform such as a perspective transform based on said temperature data and visual structure data with associated related distance and angle in combination with data describing properties of said temperature sensing means and said visual sensing means. 63 This enables projections of at least one selected object / structure of temperature and / or visual structure data with modified perspective and / or distance. Della can be used, for example, to generate a false signature as described in Fig. 14 so that reproduction of the object to be imitated can be modified so that distance to the object and the perspective of the object change relative to the distance and perspective of the temperature sensing means and or visual the detector perceives.
According to this embodiment, the user interface 630 may be arranged to provide an interface which enables an operator to select at least one object / structure which it is desired to reproduce visually and or thermally. In order to enable modifications in perspective, the software unit 620 may further be arranged to record and process data describing distance and angle to objects / structures. Over a period of time, during which said device or objects / structures are positioned so that at least different views of said objects / structures are perceived. of said temperature sensing means and / or said visual sensing means.
In cases where surface elements 500 comprise a radar absorbing element, for example according to Figures 8a-b, the control circuit according to an embodiment is arranged to communicate wirelessly. By providing at least one wireless transmitter and receiver unit and utilizing at least one resonant slot element STR of the frequency selective surface structure as an antenna, wireless communication is possible. According to this embodiment, the control circuit can be arranged to communicate in a short-wavelength frequency range such as e.g. on a 30 GHz 25 band. It is possible to reduce the number of lines associated with the communication of data / signals in the said control circuit and or in the support structure / framework as described in, for example, Figure 11d.
Configuration of the control circuit may differ from that of the configuration described in Fig. 10. The control circuit may, for example, comprise four or more sub-components / lanes. Furthermore, one or more parts can be arranged 64 outside the control circuit 200 such as e.g. arranged externally in a central configuration where e.g. the user interface 630, the software unit 620 the digital / analog converter 640, the temperature sensing means 610 and the visual sensing means 615 are arranged to provide data and process data for at least one surface element 500 comprising a local control circuit, including said temperature control circuit 600 and said image control. centrally configured digital / analog converters. Furthermore, in the case where the module element 500 comprises a plurality of temperature generating elements 150: 5-150: 7, as exemplified with reference to Figs. 2a and 2b, the control circuit 200 may be arranged to control all of said plurality of temperature generating elements 150: 5-150: 7. . These can be regulated individually and / or in unison by the control circuit by sending the same voltage / current to one or more sets of temperature generating elements 150: 5-150: 7 at the module element, where the said one or more sets can comprise two or more predetermined temperature generating elements. Alternatively, a plurality of control circuits, such as a plurality of control circuits 200, may be provided with respective module elements, each of said control circuits being arranged to control all voltage / current to a temperature generating element of said plurality of temperature generating elements.
According to one embodiment, the control circuit 200 configured to be connected to a pump control circuit as to said pump control circuit PCC is exemplified with reference to Fig. 1c. It is possible to exchange information between the control circuit 200 and the pump control circuit, where said information may include descriptive current parameters, e.g. flow, temperature, which can be used by the control circuit 200 to control temperature by means of the temperature generating element or the temperature generating elements and / or where the above information can be used by the pump control circuit PCC to regulate flow to and from the liquid cooling plates LCP of respective module elements 500. Fig. 11a schematically illustrates parts XIII-a of a module system 700 comprising surface elements 500 or module elements 500 for recreating thermal background or the like; Fig. 11b schematically illustrates an enlarged part XIII-b of the modular system in Fig. 11a; and Fig. 11c schematically illustrates an enlarged part XIII-c of the part in Fig. 11b.
The individual temperature control or the individual temperature control and the individual visual control are arranged to take place in each module element 500 individually through a control circuit, for example the control circuit in Fig. 11, arranged in each module element 500. Each module element 500 is formed according to an embodiment of the module element described in Fig. 9.
According to this embodiment, the respective module elements 500 have a hexagonal shape. In Figs. 11a-b, the module elements 500 are illustrated with a checkered sample. According to this embodiment, the module system 700 comprises a framework 7 arranged to receive the respective module elements. According to this embodiment, the framework has a honeycomb configuration, ie. is composed of a number of hexagonal frames 712 where the respective hexagonal frame 712 is arranged to receive a respective module element 500.
According to this embodiment, the framework 710 is arranged to supply current. The respective hexagonal frame 712 is provided with a branch section 720 comprising a connector 720 with which the module element 500 is arranged to be brought into electrical contact. Digital information representing background temperature sensing by means of thermal sensing means according to, for example, Fig. 11 is arranged to be superimposed on the framework 710. Because the framework itself is arranged to supply current, the number of cables can be reduced. In the framework, current will be delivered to each module element 500. also, superimposed with the current, a digital sequence containing unique information for each module element 500. In this way, no cables will be behaved beyond the framework. 66 The framework is dimensioned for the height and surface of all received module elements 500.
A digital information receiver of the respective module elements as described in connection with Fig. 10 is then arranged to receive the digital information, the temperature control circuit or the temperature control circuit and an image control circuit according to Fig. 10 are arranged to control all as described in connection with Fig. 10.
According to one embodiment, the device is arranged on a vehicle such as a military vehicle. The framework 710 is then arranged to be attached to, for example, the vehicle, the framework 710 being arranged to supply both current and digital signals. By arranging the frame 710 on the hull of the vehicle, the frame 710 simultaneously provides attachment to the hull of the vehicle / vehicle, ie. the framework 710 is arranged to support the module system 700. By using module elements 500, the advantage is obtained, among other things, that if a module element 500 should fail for some reason, only the failed module element 500 needs to be replaced. Furthermore, module elements 500 can be adapted depending on the application. A modular element 500 may fail due to electrical faults such as short circuits, external influences and due to. damage from shrapnel and Other ammunition.
Electronics of the respective module elements are preferably encapsulated in the respective module elements 500 so that induction of electrical signals in, for example, antennas is minimized.
Parts of, for example, the vehicle are arranged to function as ground plane 730, while the framework 710, preferably the upper part of the framework, is arranged to form a phase. In Figs. 11b-c, the current in the framework, Ti, is a digital information containing temperatures and visual structures to module element number i. D is deviation, i.e. a digital signal that tells how big a difference there is between the temperature bar and inherited value of custom module elements. This information is sent to the opposite hall since this information bar 67 is displayed in the user interface 630 according to, for example, Figure 10 so that the user knows how good the temperature adjustment of the system is for the event.
A temperature sensing means 210 according to, for example, Fig. 10 is arranged in connection with the thermoelectric element 150 of the respective module elements 500 to sense the surface temperature of the module element 500. The surface temperature is then arranged to be continuously compared with the background temperature sensing by the thermal sensing means described above in connection with Fig. 9 and Fig. 10. As these differ in that they are means, such as a temperature control circuit described in connection with Fig. 10, arranged to regulate the voltage to the thermoelectric element of the module element so that the core and drill cores match. How signature-efficient the system is, ie. how good thermal adaptation can be achieved depends on which thermal sensing means, ie. which temperature reference is used - temperature sensor, IR sensor or IR camera.
In that the thermal sensing means according to an embodiment consists of at least one temperature sensor such as a thermometer arranged to supply the ambient temperature, a less accurate representation of the background temperature is given, but a temperature sensor has the advantage that it is cost-effective. When used with vehicles or the like, the temperature sensor is preferably arranged in the air intake of the vehicle in order to minimize the effect of heated areas of the vehicle.
By means of the thermal sensing means according to an embodiment, at least one IR sensor is arranged to supply the apparent temperature of the background, i.e. arranged to feed an average value of the background temperature is obtained according to a more correct value of the background temperature. IR sensor is preferably placed on all sides of a vehicle to address different threats. 68 In that the thermal sensing means according to one embodiment consists of at least one IR camera arranged to read the thermal structure of the background, an almost perfect adaptation to the background can be achieved where a background temperature variation can be observed on, for example, a vehicle. If a module element 500 is to correspond to the temperature of the collection of pixels occupied by the background at the current distance. These IR camera pixels are arranged to be grouped so that the resolution of the IR camera corresponds to the resolution that the resolution of the modular system can Merge, ie. that each module element 10 corresponds to one pixel. This results in a very good reproduction of the background temperature so that, for example, solar heating, snowflakes, water bodies, various emission properties, etc. of the background, which often have a different temperature than the air, can be reproduced correctly. This effectively counteracts that clear contours and large evenly warm surfaces are created so that a very good thermal camouflage of the vehicle is possible and that temperature variations on small surfaces can be 'Merges.
By means of the visual scanning means according to an embodiment consisting of at least one camera such as a video camera arranged to read the visual structure (color, monster) of the background, an almost perfect adaptation to the background can be achieved where a background visual structure can be reproduced on, for example, a vehicle . If a module element 500 is to correspond to the visual structure of the collection of pixels occupied by the background at the current distance. These camcorder pixels are arranged to be grouped so that the resolution of the camcorder corresponds to the resolution that the resolution of the modular system can Merge, i.e. that each module element corresponds to a number of pixels (pixels) defined by the number of pixels that are found arranged in the display surface of the respective module elements. This results in a very good reproduction of the background structure, so that, for example, even relatively small visual structures are taken up by the video camera Merges correctly. One or more camcorders are preferably placed on one or more sides of a vehicle to accommodate 69 views seen from several different directions. Furthermore, in cases where the display surface is configured to be direction dependent, for example according to Figure 7d-e, the visual structure can be relieved by the visual sensing means at different angles to individually control pixels adapted to image reproduction at different viewing angles so that these merge the visual structure corresponding towards the direction in which it is relieved by the visual sensing means.
Fig. 11d schematically illustrates a plan view of a modular system XIV or a part of a modular system VII comprising surface elements for signature adaptation according to an embodiment of the present invention, and Fig. 11e schematically illustrates a side view of the modular system Viii Fig. 11d.
The modular system VIV according to this embodiment differs from module elements 700 according to the embodiment illustrated in Figs. 11a-c in that the support structure is provided by a framework 710, instead of being provided by a support structure 750 consisting of one or more support elements 750 or support plates 750 arranged to support interconnected module element 500.
The support structure can thereby be formed by a support element 750 s 6 as illustrated in Figs. 7d-e, or a plurality of interconnected support elements 750.
The support element consists of some material that meets thermal requirements and requirements related to robustness and half-strength. The support element 750 is made according to an embodiment of aluminum, which gives the advantages that it is light, robust and hall-proof. Alternatively, the standing element 750 is made of steel, which is also robust and hall-solid.
The post member 750 formed in a plate configuration has according to this embodiment a substantially flat surface and a square shape. The support element 750 can alternatively be formed into another suitable shape such as e.g. rectangular shape, hexagonal shape, etc. 70 According to one embodiment, the stud element 750 has a thickness in the range 5-30 mm, for example 10-20 mm.
Interconnected module elements 500 comprising one or more temperature generating elements 150 or one or more temperature generating elements 150 and a display surface 50 as described above are arranged on the support element 750. The support element 750 is arranged to provide power supply. The support element 750 comprises links 761, 762, 771, 772, 773, 774 for communication to and from each individual module element, said links being integrated in the support element 750. According to this embodiment the module system comprises a support element 750 and seven interconnected hexagonal module elements 500 arranged on top. the standing element 750 said that a left column of two module elements 500, an intermediate column of three module elements 500 and a right-hand column of two module elements 500 are formed. A hexagonal module element is thus arranged centrally and the other six module elements are arranged around the centrally arranged module element on the support element 750.
According to this embodiment, lines for power supply and communication signals are separated and not superimposed, resulting in available bandwidth for communication Okas, thereby speeding up the communication speed. This simplifies signature changes by increasing the bandwidth of the signal speed of the communication signals. This also improves thermal and visual adaptation during movement.
By separating power supply and communication signals, interconnection of a large number of module elements 500 is simplified without affecting the communication speed. Each stand element 750 comprises a plurality of lines 771, 772, 773, 774 for digital and / or analog signals in combination with two or more lines 761, 762 for power supply. According to this embodiment, said integrated links comprise a first link 761 and a second link 762 for power supply to the usual column of module elements 500. Said integrated links further comprising a third and fourth links 771, 772 for information / communication signals to the module elements 500, wherein said signals are digital and / or analog, and a fourth and fifth link 773, 774 for information / diagnostic signals from the module elements 500, wherein said signals are digital and / or analog.
By arranging two lines, the third and fourth lines 771, 772, to provide information signals to the module elements 500 and two lines, the fifth and sixth lines 773, 774, are allowed to provide information signals from the module elements 500, the communication speed becomes substantially unlimited, i.e. communication to and tan the module elements can take place instantaneously.
Fig. 12a schematically illustrates in an exploded perspective view a module system 15 or a part XV of a device for signature adaptation according to a preferred embodiment of the present invention and Fig. 12b schematically illustrates in a partially cut perspective view the part XV illustrated in Fig. 12a with mounted module elements.
Referring to Fig. 12a, there is shown a framework 755 arranged to receive a plurality of parallel connected water cooling plates of a plurality of module elements, such as a plurality of module elements 500 exemplified with reference to Fig. 9, together with a plurality of leads associated with said plurality of parallel connected water cooling plates. In Fig. 12a, the arrows illustrate assembly instructions for the respective parallel connected water cooling plate LCP1-LCP3. The framework 755 comprises a plurality of recesses in the form of a first set of recesses LCPA1-LCPA3, each of the recesses of the first set of recesses LCPA1-LCPA3 being arranged to receive a water cooling plate, such as a water cooling plate LCP exemplified with reference to Fig. 3a. Fig. 3b. The framework 755 further comprises a second set of recesses LCH1-LCH4 arranged as channels each 72 being arranged to receive a lead. Wherein said conduit may comprise at least one of the second L2 and third conduit L3, as exemplified with reference to Fig. 1c, is to provide via said pump PU a flow to each of the cooling plates and a liquid flood from each of the cooling plates. Said line may also be a line which forms a branch of said second or third line L2, L3. In more detail, said second and third lines are configured to be connected to said first LCPF1 and said second river passage element LCPF2, respectively, as exemplified with reference to Fig. 3a. For example, the direction of influence via said second line L2 may be configured as illustrated by the arrow with reference LFD1. Each of a plurality of parallel cooling water cooling plates is arranged to be applied to a heating plate, such as the centrally located heating plate HP6 of said water cooling element layer exemplified with reference to Fig. 2d.
Modular element 500 is connected to the framework, for example according to Fig. 12a or Fig. 12b, by using a lamp connection.
The framework, for example according to Fig. 12a or Fig. 12b, can be connected to other frameworks of these types, where the frameworks are connected electrically and mechanically via connection points (not shown), for example via connection points according to Fig. 11a, for electrical connection of the standing elements via the beams. Whereby the number of connection points is minimized.
The frame 755 formed in a plate configuration has, according to one embodiment, a substantially flat surface and a square shape. The framework 755 can alternatively be formed into another suitable shape such as e.g. rectangular shape, hexagonal shape, etc. For example, the edges of the framework may be formed with a plurality of projections which have an extension tangent to the plane of the framework adapted to a partial surface of a module element 500. 73 Interconnected frameworks for example according to Fig. 12a or Fig. 12b , forming an urban structure are intended all arranged on a structure of a vessel such as e.g. a vehicle, a ship or the like.
According to one embodiment sa, the framework 755 comprises a plurality of integrated lanes (not shown), the usual integrated lane comprising a plurality of lanes for information / diagnostics / communication signals of digital / analog type to and from connected module elements 500. Each of said plurality of lanes is arranged to provide communication to and from a column of module elements 500. The said plurality of integrated loops may be formed of thin film, where narrinda thin film is arranged at the standing element 755.
According to one embodiment, said module elements 500 are connected to the framework instead of being arranged to communicate wirelessly, for example as described in connection with Fig. 10. Said wireless communication can e.g. was arranged as a mesh network or mesh network, which provides higher redundancy and reduces the range of requirements for the wireless communication because the mesh network allows each node in the network, ie. each module element 500 has tradlas contact with at least two other nodes i.e. module element. Named at least two other nodes may e.g. be at least two neighboring nodes (module elements), like all other module elements 20 directly adjacent to a module element. According to this example, the mesh network may be based on at least one of the following communication protocols Bluetooth, Zig Bee and IEEE 802.11.
It should be noted that the framework may be configured differently from the framework 755 as illustrated in Fig. 12a and Fig. 12b. For example, several or less module elements may be arranged to be fastened to the framework. Della can e.g. mean that the dimension of module elements and / or frameworks may be different. Furthermore, more or fewer recesses LCH1-LCH4 can be arranged in the framework, in which recesses more or less wires are arranged to run. Fig. 12c schematically illustrates in a side view a part XVI of a device for signature adaptation according to an embodiment of the present invention.
Referring to Fig. 12c, there is shown a modular member 500 configured for attachment to a support member or frame 750, 755, such as a support member or frame exemplified by reference to any of Figures 11d-11e or Figures 12a-12b, where power is applied to the components. of the module element 500 takes place by means of a transformer TR. A first transformer half E1 of the transformer is arranged in the framework 750 and a second transformer half E2 of the transformer is arranged in the module element 500, opposite said first transformer half E1. Said first transformer half comprises a primal winding W1 and said second transformer half comprises a secondary winding W2. By providing a voltage / current VIN to said primary winding, said voltage / current is transmitted by induction to said secondary winding with which voltage / current VOUT Or is available to the module element 500. For example, voltage / current VIN can be provided from an electric generator of the vehicle. to which the module elements and associated frameworks are connected and voltage / current VOUT can be arranged to be supplied to the control circuit of the module element, such as the control circuit 200 exemplified with reference to Fig. 6 or Fig. 10.
According to this embodiment, the respective module elements 500 are arranged to be mounted against the framework so that the transformer half of the module elements is enabled to inductively contact the transformer half arranged of the framework. Della can, for example, be made possible by fastening so that the two transformer halves with associated legs are arranged substantially opposite each other.
According to one embodiment, the transformer TR consists of an iron transformer, such as a shell type transformer of EE type, where the transformer windings are arranged around centrally placed legs of the respective transformer halves E1, E2 and where the transformer halves are built up of a number of joined laminate layers. , such as a number of punched laminate layers each formed as an "E".
The solution described above for power supply to each module is particularly advantageous with application to marine vessels as this solution reduces the risk of short circuits and that lower levels of electromagnetic straining are generated to the environment, which can be captured by enemy troops.
Fig. 13 schematically illustrates an object 800 as a vehicle 800 exposed to threats in a direction of threat, where the thermal structure 812 of the background 812 or the thermal structure and visual structure of the background by means of the device according to the present invention are recreated on the side facing the threat direction. According to one embodiment, the device comprises the modular system according to Figs. 11a-c, where the modular system is arranged on the vehicle 800.
The estimated direction of threat is illustrated by the arrow C. The target 800, for example a vehicle 800, constitutes a target. The threat may, for example, be a thermal / visual / radar reconnaissance and surveillance system, a heat-seeking robot or the like, arranged to be read on the target.
Seen in the threat direction, there is a thermal and / or visual background 810 in the C direction of the threat direction. The part 814 of this thermal and / or visual background 810 of the vehicle 800 seen from the threat is arranged to be copied by means of thermal scanning means 610 and / or visual scanning means 615 according to the invention so that a copy 814 'of that part of the thermal and / or visual or the visual background, according to a variant the thermal and / or visual structure 814 ', is seen by the threat. As described in connection with Fig. 10, the thermal sensing means 610 according to a variant comprises an IR camera, according to a variant an IR sensor and a variant a temperature sensor, where the IR camera gives the best thermal representation of the background. As described in connection with Fig. 10, the visual scanning means 615 according to a variant comprises a video camera. The thermal and / or visual background 814 ', the thermal and / or visual structure 814' of the background is arranged by means of the thermal sensing means, is arranged by means of the device according to the invention all interactively recreated on the target, has the vehicle 800, facing the threat 820 so that the vehicle 800 thermally and / or visually melts into the background.
This significantly reduces the possibility of detection and identification of threats, for example in the form of binoculars / image intensifiers / cameras / IR cameras or for a heat-seeking robot to be read on the target / vehicle 800 because it thermally and visually melts into the background. As the vehicle moves, the copied thermal structure 814 'of the background will be continuously adapted to changes in the thermal background due to the combination of thermally conductive layers with anisotropic thermal conductivity, insulating layer, thermoelectric element and continuously recorded difference between thermal sensing means for sensing thermal background. and temperature sensing means according to any one of the embodiments of the device according to the present invention.
As the vehicle moves, the copied visual structure 814 'of the background will be continuously adapted to changes in the visual structure of the background due to the combination of display surface and visual sensing means to record visual structure according to the embodiments of the device of the present invention.
Accordingly, the device of the present invention enables automatic thermal and visual adaptation and lowers contrasts against temperature varying and visual backgrounds, which defends detection, identification and recognition and reduces threats from potential painters or the like.
The device according to the present invention enables a small radar grinding area (RCS) of a vehicle, i.e. an adaptation of radar signature by utilizing frequency selective and radar suppression functionality. Where the name 77 adaptation can be maintained, both a vehicle is stationary and is in motion.
The device according to the present invention enables a law signature of a vehicle or a vehicle, i.e. low contrast, so that the contours of the vehicle, the hull, the location of the exhaust, the location and size of the cooling air, the turret, the control center, etc., ie After the signature of the vehicle by means of the device according to the present invention can be thermally and visually minimized so that a lower thermal and visual signature is given against a certain background.
The device according to the present invention with modular system according to, for example, Figs. 11a-c, offers an effective layer of thermal insulation, which reduces power consumption of, for example, AC systems with lower effects of solar heating, ie. cla device is not active so the modular system provides good thermal insulation against solar heating of the vehicle and then improves the internal climate.
Fig. 14 schematically illustrates different potential threat directions for a Forrernal 800 such as a vehicle 800 equipped with a device according to an embodiment of the invention for restoring the thermal and visual structure of the desired background and maintaining a layer of radar paint area.
According to an embodiment of the device according to the invention, the device comprises means for selecting different threat directions. According to one embodiment, the means comprises a user interface, for example as described in connection with Fig. 10. Depending on the expected threat direction, the IR signature and the visual signature will need to be adapted to different backgrounds. The user interface 630 in figure 10 and according to one embodiment graphically constitutes a way for the user to be able to easily choose from the judged threat direction which part or parts of the vehicle must be active in order to keep a law signature against the background.
By means of the user interface, the operator can choose to focus the available power of the device to achieve the best imaginable thermal / visual structure / signature, which may be required for example as the background is complicated and requires a lot of power of the device for optimal thermal and visual adaptation. a display surface.
Fig. 14 shows different threat directions for the vehicle 800 / vehicle 800, where the threat directions are illustrated by the vehicle / vehicle being plotted in a semicircle divided into sections. The threat may consist of, for example, threats from above, such as from a grinding robot 920, a helicopter 930, or the like, or from the ground, such as a soldier 940, a tank 950, a warship 960 or the like. If the threat comes from above, the temperature of the vehicle and the visual structure should coincide with the ground temperature and visual structure, while it should be adapted to the background behind the vehicle if the threat comes straight from the front in the horizontal level. According to a variant of the invention, a number of threat sectors 910a-f, for example twelve threat sectors, of which six 910a-f are referred to in Fig. 14 and a further six are opposite to the half-hazard, are defined, which can be selected by means of the interface.
The device according to the present invention has been described above where the device is used for adaptive thermal and visual camouflage so that, for example, a vehicle in motion continuously by means of the device according to the invention quickly adapts thermally and visually to the background, where the thermal structure of the background is copied by a thermal sensor. an IR camera or an IR sensor and, in cases where the device comprises a display surface, where the visual structure of the background is copied by means of a visual scanning means such as a camera / video camera. The device according to the present invention can advantageously be used RA- to generate direction-dependent visual structure, for example by utilizing a display surface according to Figs. 7d-e, i.e. utilizing a display surface capable of generating a reproduction of the visual structure of the background representative of the background seen from viewing angles falling outside a viewing angle that is substantially orthogonal to the respective display surface 79 of the module elements. For example, the device may merge a first visual structure representative of the background viewed from a viewing angle formed between a position of the helicopter 930 and a position of the vehicle 800 and a second visual structure representative of the background seen from a viewing angle formed between a position of a soldier 940 or a tank 950 or a battleship 960 and a position of the vehicle 800. This makes it possible to more faithfully recreate background structures from correct perspectives seen from different angles.
The device of the present invention can be advantageously used to generate specific thermal and / or visual samples. Della is achieved according to a variant by regulating the respective thermoelectric element and / or at least one display surface of a module system built up of module elements, for example as illustrated in Figs. 11a-c so that the module elements obtain the desired temperature and / or emit the desired spectrum, for example different temperatures and / or spectrum, whereby any desired thermal and / or visual pattern can be achieved. As a result, for example, a pattern that can only be recognized by those who know what it looks like can, in the case of, for example, a war situation, identify their own vehicles or equivalent possibilities while the enemy cannot identify the vehicle. Alternatively, a monster that everyone can recognize, such as a cross so that everyone can identify an ambulance vehicle in the ground, can be provided by means of the device according to the invention. Said specific sample may, for example, consist of a unique fractal sample. Said specific sample can further be superimposed in the sample which is desired to be generated for signature adaptation purposes so that said specific sample only becomes visible to units of own troop which are provided with sensor means / decoding means.
Thus, by using the device of the present invention to generate specific samples, IFF system functionality ("Identification-friend-or-Foe") is efficiently enabled. Information related to 80 named specific monsters, for example, can be stored in storage units associated with firing units of own squad so that sensor means / decoding means of said firing units perceive and decode / identify objects coated with said specific monsters and thereby allowed to generate information that prevents firing.
According to a further variant, the device according to the present invention can be used to generate a false signature of other vehicles for instance infiltrating the enemy. This is achieved by regulating the respective thermoelectric element and / or at least one display surface of a modular system built up of modular elements, for example as illustrated in Figs. 11a-c so as to reproduce in a vehicle rail contours, visual structures, evenly heated surfaces, cooling air bubbles or other typical hot areas that are unique to the vehicle in question. This requires information about this appearance.
According to a further variant, the device according to the present invention can be used for remote communication. This is accomplished by associating said specific samples to specific information that can be decoded by accessing the decoding table / decoding means. This enables "silent" communication of information between units where radio waves that can be perceived by enemy units do not need to be used for communication.
For example, status information related to one or more of the decreasing quantities of industry access, position of own troop, position of enemy troop, ammunition access, etc. can be communicated.
Furthermore, thermal patterns in the form of, for example, a collection of stones, grass and stone, different types of forest, urban environment (angular and straight transitions) could be achieved by means of the device according to the invention, which monsters could resemble monsters found in the visible area. Such thermal monsters are independent of threat direction and are relatively inexpensive and easy to integrate.
For the above-mentioned generation of specific thermal samples, according to a variant, no thermal sensing means and / or visual sensing means 81 is required, but it is sufficient to regulate the thermoelectric elements and / or said display surfaces, ie. apply voltage corresponding to desired temperature / spectrum far Desired thermal / visual pattern of each module element.
There are a number of application areas for a device according to the present invention by, for example, utilizing the effective signature fitting as possible. For example, the device according to the present invention can advantageously be used for de-icing objects on which said device is intended to be applied. Rejection can take place by the device according to the present invention having the possibility to regulate the external temperature of the object, which means that by regulating the external temperature so that the surface which meets the environment is heated, ice formation can be effectively counteracted and that ice layers already built up can removed.
The foregoing description of the preferred embodiments of the present invention has been provided for illustrative and descriptive purposes. It is not intended to be exhaustive or to limit the invention to the variations described. Obviously, many modifications and variations will occur to those skilled in the art. The embodiments were selected and described in order to best explain the principles of the invention and its practical applications, thereby enabling those skilled in the art to understand the invention for various embodiments and with the various modifications which are appropriate to the intended use. ra11 = 822013 -07-0,9 Signature matching device, comprising a surface element (100A; 100B; 100C; 100D; 100E; 100F, 500) arranged to assume a certain thermal distribution, said surface element comprising at least one temperature generating element (150; 150: 5, 150: 6, 150: 7) arranged to generate at least one predetermined temperature gradient to a portion of a first thermally conductive layer (80) of said surface element, characterized in that said signature matching device comprises a water cooling element (LCE) arranged to provide at least one liquid stream, thermally contacting an inner portion (150: B) of said At least one temperature generating element so that heat energy is conducted away from said at least one temperature generating element.
The device according to claim 1, wherein said water cooling element is configured for connection to at least one pump (PU) arranged to provide at least one water cooling flock to said water cooling element. An apparatus according to any preceding claim, wherein said surface element comprises a plurality of temperature generating elements, each arranged to generate at least one predetermined temperature gradient to a portion each of said first thermally conductive layer of said surface element. The device of claim 3, wherein said water cooling element layer comprises a water cooling element layer (LCEL), underlying said first heat conductive layer, said water cooling element layer comprising a plurality of apertures (AP, A1-A3, B1-B4, C1-05, D1-D4, E1-E3) arranged to receive said plurality of temperature generating elements so that said plurality of temperature generating elements thermally contact after portion of a hot plate structure (HPS), applied to and underlying said water cooling element layer and arranged to dissipate heat from said plurality of temperature generating elements in direction at the hot plate structure. The device of claim 4, wherein the water cooling element (LCE) comprises a water cooling plate (LCP) and said water cooling plate is arranged to be thermally applied to a portion of the hot plate structure.
An apparatus according to any one of claims 4-5, wherein said plurality of apertures of the water cooling element layer Jr are arranged in a geometric sample in the form of a plurality of rows and wherein said hot plate structure comprises a plurality of hot plates (HP1-HP5), arranged to apply to the water cooling element layer so as to the hotplates overlap a row of said plurality of rows of apertures of the water cooling element layer. The device of claim 6, wherein the hot plate structure comprises a transverse hot plate (HP6) arranged to thermally contact a central portion of each of said plurality of hot plates (HP1-HP5) and wherein said water cooling plate is arranged to be applied to said transverse hot plate. Device according to any of claims 2-7, wherein said water cooling element is configured for connection to said at least one pump via at least one line arranged for transporting said at least one water flow. A device according to any one of claims 2-8, wherein said at least one liquid flood comprises at least one cooling medium. The device of claim 9, wherein said at least one coolant comprises water. Device according to any one of the preceding claims, wherein said liquid cooling element is arranged to be supplied with said at least one liquid flow 25 from at least one reservoir (RE) comprising coolant. Device according to claim 11, wherein said at least one reservoir (RE) consists of seawater or seawater. Device according to any one of the preceding claims, wherein said surface element comprises at least one display surface (50) arranged to emit at least one predetermined spectrum.
An apparatus according to claim 13, wherein said at least one display surface comprises a plurality of sub-display surfaces (51A-51K), wherein said sub-display surfaces are arranged to emit at least one predetermined spectrum in at least one predetermined direction, wherein said at least one predetermined spectrum is direction dependent.
The device of claim 14, wherein said at least one predetermined direction of habit sub-display surface (51A-51K) is individually offset relative to an orthogonal axis of said display surface (50).
Device according to any one of claims 14-15, wherein said at least one display surface (50) comprises an obstructing layer (52) arranged to obstruct incident light of selected angles of incidence and an underlying hook reflecting layer (51) arranged to reflect incident light.
Device according to any one of the preceding claims, wherein the surface element comprises at least one further element (190) arranged to provide radar suppression.
Device according to any one of the preceding claims, wherein said surface element comprises a further reinforcing element (180) arranged to provide reinforcement.
Device according to any one of the preceding claims, said first heat-conducting layer (80) has anisotropic heat conduction so that heat conduction takes place mainly in the main extension direction of the layer (80). Device according to any one of the preceding claims, wherein the surface element comprises an intermediate heat-conducting element (160) arranged against and underlying the temperature-generating element, wherein the intermediate heat-conducting element has anisotropic heat conduction so that heat conduction 8 takes place substantially across the first heat conducting layer. Device according to any one of the preceding claims, wherein said surface element has a hexagonal shape. An apparatus according to any preceding claim, further comprising a thermal sensing means (610) arranged to sensitize ambient temperature, for example thermal background.
Device according to any one of claims 13-16, further comprising a visual scanning means (615) arranged to scan the visual background of the surroundings, for example visual structural background.
Device according to any one of the preceding claims, wherein the device comprises a plurality of surface elements (100A-100F, 500), the liquid cooling element of each of said plurality of surface elements being connected in parallel. At least one conduit (L2) for influencing said at least one liquid flow and at least one conduit (L3) for outflow of said at least one water floc.
Device according to any one of the preceding claims, wherein the device comprises a framework (710) or support structure (750; 755), wherein the framework or support structure is arranged to support a plurality of joined surface elements (100A-100F, 500) and to provide load and control signals / communication to said plurality. joined surface elements. An object (800), for example a marine vessel (800), comprising a device according to any one of the preceding claims. ink, 1.ftl. unh rnhIfrIpIHvpflf 2013 -07- 0 9 1 / Fig. 1a L CrE-N Fig. lb 80V - 100A 150: A31, -xxxxxxxxxxxa moo 0: 4 cocis1 150: B Fig. 1c Ink, 1, Potent och roplitperlamorket 2013 - 07- 0 9 2 / ffi Fig. Id 6 is4x- -4r ir Or ir 1100B tir A 160 r: => r >>. t = ›- <= 2 9-1> Fig. le 41- id registrepingsverket 2013 -07- 09 Fig. 2a LCEL 150: 150: 6 150: 7 80 Fig. 2d HP Fig. 2c LCEL LCEL LCEL HP6 HP3 Fig. 2b HP1 HP2 HP4 3 / HPS aunt and director ring work 2013 -07- 0 9 4 / LCP Fig. 3b Ink. t. Patent. uch rilloteerInneverket 2013 -07- 09 5 / och rgalloiringivirkg 2013 -07- 09 6 / yin Ammiimmummommommilm AMMEMMOMMIMMEMMEMMEM. - "" 011141MMIIII "'" 80 150 LCE 4‘Qinfo Fig. 5aVW IOOD 80 wwww 20 LCE-N-) 1 Fig. 5b 203 100A 2 2041 Fig. 6 1 hi. IP1110111. and Regulatory Report 2013 -07- 09 7 / LE LI Fig. 7a LR Fig. 7b Fig. 76 • 5 52 51 Fig. 7d P1 P2 P3 P4 S1 S2 S3 S4 .......... 1. Nellt, OPh rupiervIngmekat 2013 -07 ° 09 8/53 5 Fig. 7e 51G 51H 82 100E 80 131 190; EL H LCP jFig. 8a 81XI82 100F 160 80 1 131 190 180 LCEL LCP 160 Fig. 8b Ink. I. Men! tick rellitmlogivotikt 2013 -07- 0 9 9 / STR Fig. 8c Fig. 8d 570 Fig. 9 Ink. I. Patent- och registreriogsvOnel 2013 -07- 09 10 / XII 603 1 Fig. 600 6 606 660 6 66 601 598 65 604 60 602 / - ■ (- 599 626 67 J r .303 i (- 322 500 2 Ink. I Met och replateeringsverliet 2013 -07- 0 9 11 / XIII-a 712 700 500, t • fr 4 7 ''04 #, t, 4k I..iy ..... 4 ....
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权利要求:
Claims (20)
[1]
A signature matching device, comprising a surface element (100A; 100B; 100C; 100D; 100E; 100F, 500) arranged to assume a certain thermal distribution, said surface element comprising at least one temperature generating element (150; 150: 5, 150: 6). , 150: 7) arranged to generate at least one danger-determined temperature gradient to a portion of a first thermally conductive layer (80) of said surface element, characterized in that said signature matching device comprises a water cooling element (LCE) arranged to provide at least one water flowing, thermally contacting inner portion (150: B) of said At least one temperature generating element so that heat energy is conducted away from said at least one temperature generating element.
[2]
The device according to claim 1, wherein said water cooling element is configured for connection to at least one pump (PU) arranged to provide at least one water cooling flock to said water cooling element. 15
[3]
An apparatus according to any preceding claim, wherein said surface element comprises a plurality of temperature generating elements, each arranged to generate at least one predetermined temperature gradient to a portion each of said first thermally conductive layer of said surface element.
[4]
The device of claim 3, wherein said water cooling element layer comprises a water cooling element layer (LCEL), underlying said first heat conductive layer, said water cooling element layer comprising a plurality of apertures (AP, A1-A3, B1-B4, C1-05, D1-D4, E1-E3) arranged to receive said plurality of temperature generating elements so that said plurality of temperature generating elements thermally contact after portion of a hot plate structure (HPS), applied to and underlying said water cooling element layer and arranged to dissipate heat from said plurality of temperature generating elements in direction at the hot plate structure.
[5]
The device according to claim 4, wherein the narcissistic liquid cooling element (LCE) comprises a liquid cooling plate (LCP) and wherein said liquid cooling plate is arranged to be thermally applied to a portion of the annealing hot plate structure.
[6]
Device according to any one of claims 4-5, wherein said plurality of apertures of the water cooling element layer Jr are arranged in a geometric sample in the form of a plurality of rows and wherein said hot plate structure comprises a plurality of hot plates (HP1-HP5), arranged to be applied to the water cooling element layer sa that each of the hot plates overlaps a row of said plurality of rows of apertures of the water cooling element layer. 10
[7]
The device according to claim 6, wherein the hot plate structure comprises a transverse hot plate (HP6) arranged to thermally contact a central portion of each of said plurality of hot plates (HP1-HP5) and wherein said water cooling plate is arranged to be applied to said transverse hot plate. 15
[8]
Device according to any one of claims 2-7, wherein said water cooling element is configured for connection to said at least one pump via at least one line arranged for transporting said at least one water flow.
[9]
A device according to any one of claims 2-8, wherein said at least one liquid flood comprises at least one cooling medium.
[10]
The device of claim 9, wherein said at least one coolant comprises water.
[11]
Device according to any one of the preceding claims, wherein said liquid cooling element is arranged to be supplied with said at least one liquid flow 25 from at least one reservoir (RE) comprising coolant.
[12]
Device according to claim 11, wherein said at least one reservoir (RE) consists of seawater or seawater. 84
[13]
Device according to any one of the preceding claims, wherein said surface element comprises at least one display surface (50) arranged to emit at least one predetermined spectrum.
[14]
The apparatus of claim 13, wherein said at least one display surface comprises a plurality of sub-display surfaces (51A-51K), said sub-display surfaces being arranged to emit at least one predetermined spectrum in at least one predetermined direction, wherein said at least one predetermined spectrum is direction dependent.
[15]
The device of claim 14, wherein said at least one predetermined direction of habit sub-display surface (51A-51K) is individually offset relative to an orthogonal axis of said display surface (50).
[16]
Device according to any of claims 14-15, wherein said at least one display surface (50) comprises an obstructing layer (52) arranged to obstruct incident light of selected angles of incidence and an underlying hook reflecting layer (51) arranged to reflect incident light.
[17]
An apparatus according to any preceding claim, wherein the surface element comprises at least one further element (190) arranged to provide radar suppression.
[18]
A device according to any one of the preceding claims, wherein said surface element comprises a further reinforcing element (180) arranged to provide reinforcement.
[19]
Device according to any one of the preceding claims, said first heat-conducting layer (80) has anisotropic heat conduction such that heat conduction takes place mainly in the main extension direction of the layer (80). 25
[20]
Device according to any one of the preceding claims, wherein the surface element comprises an intermediate heat-conducting element (160) arranged against and underlying the temperature-generating element, wherein the intermediate heat-conducting element has anisotropic heat-conducting means such that heat-conducting

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法律状态:

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申请号 | 申请日 | 专利标题

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SE1350855A|SE538960C2|2013-07-09|2013-07-09|Signature matching device and objects provided with signature matching device|SE1350855A| SE538960C2|2013-07-09|2013-07-09|Signature matching device and objects provided with signature matching device|

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BR112015030721-3A| BR112015030721B1|2013-07-09|2014-07-02|SUBSCRIPTION DEVICE FOR SUBSCRIPTION|

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SG11201509654VA| SG11201509654VA|2013-07-09|2014-07-02|Device for signature adaptation and object provided with device for signature adaptation|

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CA2914777A| CA2914777C|2013-07-09|2014-07-02|Device for signature adaptation and object provided with device for signature adaptation|

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PCT/SE2014/050838| WO2015005852A1|2013-07-09|2014-07-02|Device for signature adaptation and object provided with device for signature adaptation|

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EP14823496.6A| EP3019814B1|2013-07-09|2014-07-02|Device for signature adaptation and object provided with device for signature adaptation|

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IL242785A| IL242785A|2013-07-09|2015-11-25|Device for signature adaptation and object provided with device for signature adaptation|